Journal ArticleDOI
Thermal Characterization Using Optical Methods of AlGaN/GaN HEMTs on SiC Substrate in RF Operating Conditions
Lény Baczkowski,Jean-Claude Jacquet,Olivier Jardel,Chistophe Gaquiere,Myriam Moreau,Dominique Carisetti,Laurent Brunel,Franck Vouzelaud,Yves Mancuso +8 more
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TLDR
In this article, a complete thermal characterization of AlGaN/gallium nitride (GaN) on silicon carbide high electron-mobility transistors (HEMTs) when devices are operating in dc bias, pulsed, and continuous wave was presented.Abstract:
Performance and reliability of wide bandgap high-power amplifiers are correlated with their thermal behavior. Thermal model development and suitable temperature measurement systems are necessary to quantify the channel temperature of devices in real operating conditions. As a direct temperature measurement within a channel is most of the time not achievable, the common approach is to measure the device temperature at different locations close to the hotspot and then to use simulations to estimate the channel temperature. This paper describes a complete thermal characterization of AlGaN/gallium nitride (GaN) on silicon carbide high electron-mobility transistors (HEMTs) when devices are operating in dc bias, pulsed, and continuous wave. Infrared thermography, charge-coupled device-based thermoreflectance microscopy, and micro-Raman spectroscopy have been performed to extract the thermal resistance of the components. Results have been compared with simulations using a 3-D finite-element model to estimate the operating channel temperature. Measurements have shown that the RF-biased thermal resistance and the dc-biased thermal resistance of GaN HEMTs are similar.read more
Citations
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Journal ArticleDOI
The Impact of Temperature on GaN/Si HEMTs Under RF Operation Using Gate Resistance Thermometry
TL;DR: In this article, the effect of the baseplate temperature on the device's thermal performance both under steady-state and RF operations was investigated, and a linear correlation was found between the power-added efficiency and the junction temperature.
On-Chip Integrated High-Sensitivity Temperature Sensor Based on p-GaN/AlGaN/GaN Heterostructure
Jie Chang,Yulian Yin,Jiahong Du,Huan Wang,Haoran Li,Changhui Zhao,Hui Li,Cungang Hu,Wenping Cao,Xi Tang,Shu Yang +10 more
TL;DR: In this paper , an on-chip integrated temperature sensor based on a GaN/AlGaN/GaN heterostructure is demonstrated, which consists of a two-dimensional-electron-gas (2DEG) resistor and a Schottky-metal/
Journal ArticleDOI
On-Chip Integrated High-Sensitivity Temperature Sensor Based on <i>p</i>-GaN/AlGaN/GaN Heterostructure
TL;DR: In this article , an integrated temperature sensor based on a GaN/AlGaN/GaN heterostructure is demonstrated, which consists of a two-dimensional-electron-gas (2DEG) resistor and a Schottky-metal.
Proceedings ArticleDOI
Theoretical analysis of substrate effects on the DC performance of AlGaN/GaN high electron mobility transistor
Abu Syed,Md. Jannatul Islam,S M Hasanuzzaman,Amit Kumer Podder,Md. Sherajul Islam,Ashraful G. Bhuiyan +5 more
TL;DR: In this article, the theoretical analysis of substrate (Sapphire, Si, SiC, Diamond) effects on the saturation drain current and transconductance of Al. 27 Ga. 73 N/GaN high-electron mobility transistor using analytical approach.
Journal ArticleDOI
Bias-Dependence of Electroluminescence in AlGaN/GaN High-Electron-Mobility Transistors on SiC Substrate
TL;DR: In this article , bias-dependence of electroluminescence in an AlGaN/GaN HEMT fabricated on a SiC substrate was investigated with a combination of a top-side view using a CMOS sensor camera and a backside view with a silicon-intensified CCD.
References
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Journal ArticleDOI
GaN-Based RF Power Devices and Amplifiers
TL;DR: The latest developments of the GaN HEMT technologies, including material growth, processing technologies, device epitaxial structures and MMIC designs, are reviewed to achieve the state-of-the-art microwave and millimeter-wave performance.
Journal ArticleDOI
A Review of GaN on SiC High Electron-Mobility Power Transistors and MMICs
TL;DR: Examples of broadband amplifiers, as well as several of the main areas of high-efficiency amplifier design-notably Class-D, Class-E, class-F, and Class-J approaches, Doherty PAs, envelope-tracking techniques, and Chireix outphasing are described.
Journal ArticleDOI
Enhancement of breakdown voltage in AlGaN/GaN high electron mobility transistors using a field plate
TL;DR: In this paper, the authors investigated the breakdown (V/sub br/) enhancement potential of the field plate (FP) technique in the context of AlGaN/GaN power HEMTs.
Journal ArticleDOI
Measurement of temperature in active high-power AlGaN/GaN HFETs using Raman spectroscopy
TL;DR: In this paper, the authors report on the noninvasive measurement of temperature, i.e., self-heating effects, in active AlGaN/GaN HFETs grown on sapphire and SiC substrates.
Proceedings ArticleDOI
Temperature measurements of semiconductor devices - a review
TL;DR: There are several methods for measuring the temperature of an operating semiconductor device as discussed by the authors, which can be broadly placed into three generic categories: electrical, optical, and physically contacting. But, as discussed in Section 2.1, some of the advantages and disadvantages as well as the spatial, time, and temperature resolution are also provided.