Journal ArticleDOI
A Practical Implementation of Silicon Microchannel Coolers for High Power Chips
Evan G. Colgan,Bruce K. Furman,Michael A. Gaynes,W. Graham,Nancy C. LaBianca,John H. Magerlein,Robert J. Polastre,M.B. Rothwell,Raschid J. Bezama,Rehan Choudhary,Kenneth C. Marston,Hilton T. Toy,Jamil A. Wakil,Jeffrey A. Zitz,Roger R. Schmidt +14 more
TLDR
In this paper, the authors describe a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors, which is able to cool chips with average power densities of 400W/cm2 or more.Abstract:
This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm2 /W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of <35kPa. Further, cooling of a thermal test chip with a microchannel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300W/cm2. Coolers of this design should be able to cool chips with average power densities of 400W/cm2 or moreread more
Citations
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Journal ArticleDOI
Significant Nusselt number increase in microchannels with a segmented flow of two immiscible liquids: An experimental study
TL;DR: In this paper, a novel experimental study of convective heat transfer in serpentine microchannels with segmented liquid-liquid emulsions is presented, and it is demonstrated that this concept yields significant Nusselt number enhancement in microchannel heat sinks compared to that obtained using single phase liquid cooling.
Journal ArticleDOI
Similarities and differences between flow boiling in microchannels and pool boiling
TL;DR: In this article, the authors explored the underlying heat transfer mechanisms and illustrates the similarities and differences between the two processes and showed that the formation of elongated bubbles and their passage over the microchannel walls have similarities to the bubble ebullition cycle in pool boiling.
Journal ArticleDOI
A review of heat transfer enhancement through flow disruption in a microchannel
Anupam Dewan,Pankaj Srivastava +1 more
TL;DR: A comprehensive review of heat transfer enhancement through microchannels has been presented in this paper, where a number of heat augmentation techniques have been reported on flow disruption through microchannel, such as shape of channel, dimple surfaces, ribs, cavities, groove structures, porous medium, etc.
Journal ArticleDOI
Hot water cooled electronics: Exergy analysis and waste heat reuse feasibility
Severin Zimmermann,Severin Zimmermann,Manish K. Tiwari,Ingmar Meijer,Stephan Paredes,Bruno Michel,Dimos Poulikakos +6 more
TL;DR: In this paper, an experimental study on exergetically efficient electronics cooling using hot water as coolant was conducted and it was shown that water temperatures as high as 60°C are sufficient to cool microprocessors with over 90% first law (energy based) efficiency.
Patent
Variable flow computer cooling system for a data center and method of operation
TL;DR: In this paper, a data center having a plurality of liquid cooled computer systems is described, where the computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor.
References
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Journal ArticleDOI
High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Journal ArticleDOI
Challenges, developments and applications of silicon deep reactive ion etching
F. Laermer,A. Urban +1 more
TL;DR: In this article, an optimized hardware for balanced RF drive at high power levels (3 kW) of the inductive plasma source in combination with spatial ion discrimination and collimation yields etch-rates in excess of 10 µm/min with excellent uniformity of profile and rate distribution.
Proceedings ArticleDOI
Micro-channel heat exchanger optimization
G.M. Harpole,J.E. Eninger +1 more
TL;DR: In this article, a complete two-dimensional flow/thermal model of the micro-channel cooler was developed, and the design parameters were optimized for the case of a 1 kW/cm/sup 2/ heat flux with the top surface at 25 degrees C.
Proceedings ArticleDOI
Single-Phase Heat Transfer Enhancement Techniques in Microchannel and Minichannel Flows
TL;DR: In this article, the applicability of single-phase heat transfer enhancement techniques for microchannels and minichannels is evaluated, where the major techniques include flow transition, boundary layer, entrance region, vibration, electric fields, swirl flow, secondary flow and mixers.
Journal ArticleDOI
Cooling characteristics of diamond-shaped interrupted cooling fin for high-power LSI devices
T. Kishimoto,S. Saski +1 more
TL;DR: In this paper, a diamond-shaped interrupted microgrooved cooling fin was proposed to decrease the junction temperature variation across the chip, and the analytical results indicated that the reduction in junction temperature was less than 25% compared with a conventional paralles-plate-shaped cooling fin.