Journal ArticleDOI
A Practical Implementation of Silicon Microchannel Coolers for High Power Chips
Evan G. Colgan,Bruce K. Furman,Michael A. Gaynes,W. Graham,Nancy C. LaBianca,John H. Magerlein,Robert J. Polastre,M.B. Rothwell,Raschid J. Bezama,Rehan Choudhary,Kenneth C. Marston,Hilton T. Toy,Jamil A. Wakil,Jeffrey A. Zitz,Roger R. Schmidt +14 more
TLDR
In this paper, the authors describe a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors, which is able to cool chips with average power densities of 400W/cm2 or more.Abstract:
This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm2 /W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of <35kPa. Further, cooling of a thermal test chip with a microchannel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300W/cm2. Coolers of this design should be able to cool chips with average power densities of 400W/cm2 or moreread more
Citations
More filters
Journal ArticleDOI
A review of liquid flow and heat transfer in microchannels with emphasis to electronic cooling
TL;DR: In this paper, the main focus is the flow and heat transfer regime related to electronic cooling in evolving channel forms, whose fabrication is being enabled by the significant advancement in micro-technologies.
Journal ArticleDOI
A numerical and experimental investigation on microscale heat transfer effect in the combined entry region in macro geometries
Kian Shing Kong,Kim Tiow Ooi +1 more
TL;DR: In this paper, an insert was placed concentrically into the channel to make the flow path small enough to behave like a microchannel in order to attain high heat removal capabilities.
Journal ArticleDOI
Advanced micro-heat exchangers for high heat flux
TL;DR: In this paper, three micro-heat exchangers for use in a liquid cooling system with a long offset strip, short offset strip and chevron flow path based on the traditional heat transfer enhancement concepts were designed and tested.
Proceedings ArticleDOI
Waste heat recovery in supercomputers and 3D integrated liquid cooled electronics
Manish K. Tiwari,Severin Zimmermann,Chander Shekhar Sharma,Fabio Alfieri,Adrian Renfer,Thomas Brunschwiler,Ingmar Meijer,Bruno Michel,Dimos Poulikakos +8 more
TL;DR: In this article, the authors show that the superior thermal properties of water make it possible to cool electronic chips and data centers using hot water with inlet temperature up to 60°C.
Proceedings Article
Hotspot-adapted cold plates to maximize system efficiency
Thomas Brunschwiler,Hugo E. Rothuizen,Stephan Paredes,Bruno Michel,Evan G. Colgan,Pepe Bezama +5 more
TL;DR: In this paper, the potential and limitations of hotspot-adapted liquid heat removal to improve system pumping power and reusability of output heat, for various packaging schemes at the component level, were modeled.
References
More filters
Journal ArticleDOI
High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Journal ArticleDOI
Challenges, developments and applications of silicon deep reactive ion etching
F. Laermer,A. Urban +1 more
TL;DR: In this article, an optimized hardware for balanced RF drive at high power levels (3 kW) of the inductive plasma source in combination with spatial ion discrimination and collimation yields etch-rates in excess of 10 µm/min with excellent uniformity of profile and rate distribution.
Proceedings ArticleDOI
Micro-channel heat exchanger optimization
G.M. Harpole,J.E. Eninger +1 more
TL;DR: In this article, a complete two-dimensional flow/thermal model of the micro-channel cooler was developed, and the design parameters were optimized for the case of a 1 kW/cm/sup 2/ heat flux with the top surface at 25 degrees C.
Proceedings ArticleDOI
Single-Phase Heat Transfer Enhancement Techniques in Microchannel and Minichannel Flows
TL;DR: In this article, the applicability of single-phase heat transfer enhancement techniques for microchannels and minichannels is evaluated, where the major techniques include flow transition, boundary layer, entrance region, vibration, electric fields, swirl flow, secondary flow and mixers.
Journal ArticleDOI
Cooling characteristics of diamond-shaped interrupted cooling fin for high-power LSI devices
T. Kishimoto,S. Saski +1 more
TL;DR: In this paper, a diamond-shaped interrupted microgrooved cooling fin was proposed to decrease the junction temperature variation across the chip, and the analytical results indicated that the reduction in junction temperature was less than 25% compared with a conventional paralles-plate-shaped cooling fin.