Journal ArticleDOI
A Practical Implementation of Silicon Microchannel Coolers for High Power Chips
Evan G. Colgan,Bruce K. Furman,Michael A. Gaynes,W. Graham,Nancy C. LaBianca,John H. Magerlein,Robert J. Polastre,M.B. Rothwell,Raschid J. Bezama,Rehan Choudhary,Kenneth C. Marston,Hilton T. Toy,Jamil A. Wakil,Jeffrey A. Zitz,Roger R. Schmidt +14 more
TLDR
In this paper, the authors describe a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors, which is able to cool chips with average power densities of 400W/cm2 or more.Abstract:
This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm2 /W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of <35kPa. Further, cooling of a thermal test chip with a microchannel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300W/cm2. Coolers of this design should be able to cool chips with average power densities of 400W/cm2 or moreread more
Citations
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Journal ArticleDOI
Benchmarking Study on the Thermal Management Landscape for Three-Dimensional Integrated Circuits: From Back-Side to Volumetric Heat Removal
TL;DR: An overview of the thermal management landscape with focus on heat dissipation from three-dimensional (3D) chip stacks is provided in this article, where three topologies, namely, single-side, dual-side and finally, volumetric heat removal, are benchmarked with respect to a high-performance three-tier chip stack with an aggregate power dissipation of 672 W.
Journal ArticleDOI
Numerical Simulation of Heat Transfer Enhancement in Periodic Converging-diverging Microchannel
TL;DR: In this article, the effect of Reynolds number, converging/diverging angle and converging-divergence cross-section length on pressure drop and heat transfer in three-dimensional converging diverging microchannel of circular crosssection is studied numerically.
Proceedings ArticleDOI
Experimental investigation of hotspot removal using superlattice cooler
TL;DR: In this article, a hybrid cooling scheme which combines microfluidic and solidstate cooling techniques was proposed to remove a localized hotspot with heat flux close to 250 W/cm2.
Journal ArticleDOI
Numerical investigations of heat transfer in hybrid microchannel heat sink with multi-jet impinging and trapezoidal fins
TL;DR: In this paper, a multi-jet impinging system with trapezoidal fins and secondary channels is proposed to efficiently cool the electronic component, and the effects of different jet arrangement patterns and geometric parameters on heat transfer in the heat sinks were investigated through numerical simulations.
Journal ArticleDOI
PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays
Artem Aleksandrovich Andreev,Arvind Sridhar,Mohamed M. Sabry,Marina Zapater,Patrick Ruch,Bruno Michel,David Atienza +6 more
TL;DR: This paper validates the electrochemical model against experimental data obtained using a micro-scale FCA, and extends PowerCool with a compact thermal model (3D-ICE) and subthreshold leakage estimation, and shows the sensitivity of the FCA cooling and power generation on the design-time and run-time parameters.
References
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Journal ArticleDOI
High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Journal ArticleDOI
Challenges, developments and applications of silicon deep reactive ion etching
F. Laermer,A. Urban +1 more
TL;DR: In this article, an optimized hardware for balanced RF drive at high power levels (3 kW) of the inductive plasma source in combination with spatial ion discrimination and collimation yields etch-rates in excess of 10 µm/min with excellent uniformity of profile and rate distribution.
Proceedings ArticleDOI
Micro-channel heat exchanger optimization
G.M. Harpole,J.E. Eninger +1 more
TL;DR: In this article, a complete two-dimensional flow/thermal model of the micro-channel cooler was developed, and the design parameters were optimized for the case of a 1 kW/cm/sup 2/ heat flux with the top surface at 25 degrees C.
Proceedings ArticleDOI
Single-Phase Heat Transfer Enhancement Techniques in Microchannel and Minichannel Flows
TL;DR: In this article, the applicability of single-phase heat transfer enhancement techniques for microchannels and minichannels is evaluated, where the major techniques include flow transition, boundary layer, entrance region, vibration, electric fields, swirl flow, secondary flow and mixers.
Journal ArticleDOI
Cooling characteristics of diamond-shaped interrupted cooling fin for high-power LSI devices
T. Kishimoto,S. Saski +1 more
TL;DR: In this paper, a diamond-shaped interrupted microgrooved cooling fin was proposed to decrease the junction temperature variation across the chip, and the analytical results indicated that the reduction in junction temperature was less than 25% compared with a conventional paralles-plate-shaped cooling fin.