Journal ArticleDOI
A Practical Implementation of Silicon Microchannel Coolers for High Power Chips
Evan G. Colgan,Bruce K. Furman,Michael A. Gaynes,W. Graham,Nancy C. LaBianca,John H. Magerlein,Robert J. Polastre,M.B. Rothwell,Raschid J. Bezama,Rehan Choudhary,Kenneth C. Marston,Hilton T. Toy,Jamil A. Wakil,Jeffrey A. Zitz,Roger R. Schmidt +14 more
TLDR
In this paper, the authors describe a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors, which is able to cool chips with average power densities of 400W/cm2 or more.Abstract:
This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm2 /W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of <35kPa. Further, cooling of a thermal test chip with a microchannel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300W/cm2. Coolers of this design should be able to cool chips with average power densities of 400W/cm2 or moreread more
Citations
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Journal ArticleDOI
Heat transfer enhancement of droplet two-phase flow in cylindrical microchannel
TL;DR: In this article, the heat transfer enhancement of droplet two-phase flow in cylindrical microchannel is numerically studied by VOF method and the average vorticity magnitude inside droplet is extracted to quantitatively represent the circulation strength.
Dissertation
Experimental Investigation of Thermo-Hydraulic Characteristics of Two-Phase Flow of FC72 in Microchannel Heat Sinks
TL;DR: In this article, the authors present a review of the literature on micro-channel flow boiling and heat transfer in microchannels and present a multichannel configuration for electronics cooling applications.
Proceedings ArticleDOI
Two-Phase Flow Across a Bank of Hydrofoil Micro Pin Fins
Brandon Schneider,Yoav Peles +1 more
TL;DR: In this article, the boiling flow of R-123 in a hydrofoil-based micro pin fin heat sink has been investigated at exit pressures ranging from 486 kPa to 539 kPa.
Journal ArticleDOI
A bio-inspired fractal microchannel heat sink with secondary modified structure and sub-total-sub fluid transmission mode for high heat flux and energy-saving heat dissipation
TL;DR: In this article , a composite microchannel with fractal microchannel serving as the main structure and secondary modified structure is proposed in order to maintain high heat flux heat dissipation capacity (HFHDC) and greatly reduce energy consumption of heat disipation, and a fluid guided layer providing high fluid distribution and lower pressure drop is designed to recollect the distributed fluid at the end of the microchannel and discharge the cooling water.
Proceedings ArticleDOI
Thermal characteristics of two-phase flow of a dielectric fluid in surface-augmented microchannels
TL;DR: In this paper, an experimental investigation of flow boiling of dielectric fluid FC72 in a heal sink consisting of 19 microchannels of height 346 mum and width 200 mum (hydraulic diameter = 253 mum).
References
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Journal ArticleDOI
High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Journal ArticleDOI
Challenges, developments and applications of silicon deep reactive ion etching
F. Laermer,A. Urban +1 more
TL;DR: In this article, an optimized hardware for balanced RF drive at high power levels (3 kW) of the inductive plasma source in combination with spatial ion discrimination and collimation yields etch-rates in excess of 10 µm/min with excellent uniformity of profile and rate distribution.
Proceedings ArticleDOI
Micro-channel heat exchanger optimization
G.M. Harpole,J.E. Eninger +1 more
TL;DR: In this article, a complete two-dimensional flow/thermal model of the micro-channel cooler was developed, and the design parameters were optimized for the case of a 1 kW/cm/sup 2/ heat flux with the top surface at 25 degrees C.
Proceedings ArticleDOI
Single-Phase Heat Transfer Enhancement Techniques in Microchannel and Minichannel Flows
TL;DR: In this article, the applicability of single-phase heat transfer enhancement techniques for microchannels and minichannels is evaluated, where the major techniques include flow transition, boundary layer, entrance region, vibration, electric fields, swirl flow, secondary flow and mixers.
Journal ArticleDOI
Cooling characteristics of diamond-shaped interrupted cooling fin for high-power LSI devices
T. Kishimoto,S. Saski +1 more
TL;DR: In this paper, a diamond-shaped interrupted microgrooved cooling fin was proposed to decrease the junction temperature variation across the chip, and the analytical results indicated that the reduction in junction temperature was less than 25% compared with a conventional paralles-plate-shaped cooling fin.