Journal ArticleDOI
A Practical Implementation of Silicon Microchannel Coolers for High Power Chips
Evan G. Colgan,Bruce K. Furman,Michael A. Gaynes,W. Graham,Nancy C. LaBianca,John H. Magerlein,Robert J. Polastre,M.B. Rothwell,Raschid J. Bezama,Rehan Choudhary,Kenneth C. Marston,Hilton T. Toy,Jamil A. Wakil,Jeffrey A. Zitz,Roger R. Schmidt +14 more
TLDR
In this paper, the authors describe a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors, which is able to cool chips with average power densities of 400W/cm2 or more.Abstract:
This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm2 /W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of <35kPa. Further, cooling of a thermal test chip with a microchannel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300W/cm2. Coolers of this design should be able to cool chips with average power densities of 400W/cm2 or moreread more
Citations
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Journal ArticleDOI
Experimental analysis of heat transfer in ribbed microchannel
TL;DR: In this paper, different inclined micro ribs with the height of 100 μm were fabricated on 20 mm × 20 mm copper plate and placed in microchannel with a height of 200 μm.
Journal ArticleDOI
Enhancement of Hotspot Cooling With Diamond Heat Spreader on Cu Microchannel Heat Sink for GaN-on-Si Device
TL;DR: In this paper, a diamond heat spreader has been directly attached between the test chip and the Cu microchannel heat sink for thermal performance enhancement of the GaN-on-Si device.
Journal ArticleDOI
Evaluation of Pressure Drop Performance During Enhanced Flow Boiling in Open Microchannels With Tapered Manifolds
Ankit Kalani,Satish G. Kandlikar +1 more
TL;DR: In this article, a novel flow boiling design using open microchannels with a tapered manifold (OMM) was experimentally investigated to overcome the above-mentioned disadvantages while presenting a very low pressure drop.
Journal ArticleDOI
Heat transfer enhancement of self-rewetting aqueous n-butanol solutions boiling in microchannels
Anze Sitar,Iztok Golobic +1 more
TL;DR: In this article, aqueous n-butanol solutions and pure butanol were used in arrays of parallel microchannels with a cross-section of 25-25-μm and 50-×-50 -μm.
Journal ArticleDOI
Numerical Investigation of Heat Transfer Enhancement in a Microchannel With Grooved Surfaces
Omid Abouali,N. Baghernezhad +1 more
TL;DR: In this article, a numerical investigation for two types of grooves (rectangular and arc shapes) fabricated in the microchannel surfaces, which leads to enhancement in single-phase cooling, is presented.
References
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Journal ArticleDOI
High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Journal ArticleDOI
Challenges, developments and applications of silicon deep reactive ion etching
F. Laermer,A. Urban +1 more
TL;DR: In this article, an optimized hardware for balanced RF drive at high power levels (3 kW) of the inductive plasma source in combination with spatial ion discrimination and collimation yields etch-rates in excess of 10 µm/min with excellent uniformity of profile and rate distribution.
Proceedings ArticleDOI
Micro-channel heat exchanger optimization
G.M. Harpole,J.E. Eninger +1 more
TL;DR: In this article, a complete two-dimensional flow/thermal model of the micro-channel cooler was developed, and the design parameters were optimized for the case of a 1 kW/cm/sup 2/ heat flux with the top surface at 25 degrees C.
Proceedings ArticleDOI
Single-Phase Heat Transfer Enhancement Techniques in Microchannel and Minichannel Flows
TL;DR: In this article, the applicability of single-phase heat transfer enhancement techniques for microchannels and minichannels is evaluated, where the major techniques include flow transition, boundary layer, entrance region, vibration, electric fields, swirl flow, secondary flow and mixers.
Journal ArticleDOI
Cooling characteristics of diamond-shaped interrupted cooling fin for high-power LSI devices
T. Kishimoto,S. Saski +1 more
TL;DR: In this paper, a diamond-shaped interrupted microgrooved cooling fin was proposed to decrease the junction temperature variation across the chip, and the analytical results indicated that the reduction in junction temperature was less than 25% compared with a conventional paralles-plate-shaped cooling fin.