Journal ArticleDOI
A Practical Implementation of Silicon Microchannel Coolers for High Power Chips
Evan G. Colgan,Bruce K. Furman,Michael A. Gaynes,W. Graham,Nancy C. LaBianca,John H. Magerlein,Robert J. Polastre,M.B. Rothwell,Raschid J. Bezama,Rehan Choudhary,Kenneth C. Marston,Hilton T. Toy,Jamil A. Wakil,Jeffrey A. Zitz,Roger R. Schmidt +14 more
TLDR
In this paper, the authors describe a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors, which is able to cool chips with average power densities of 400W/cm2 or more.Abstract:
This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm2 /W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of <35kPa. Further, cooling of a thermal test chip with a microchannel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300W/cm2. Coolers of this design should be able to cool chips with average power densities of 400W/cm2 or moreread more
Citations
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Journal ArticleDOI
State of the Art of High Heat Flux Cooling Technologies
TL;DR: In this paper, a literature review is presented to compare different cooling technologies currently in development in research laboratories that are competing to solve the challenge of cooling the next generation of high heat flux computer chips.
Journal ArticleDOI
A critical review of traditional and emerging techniques and fluids for electronics cooling
TL;DR: In this paper, a critical review of traditional and emerging cooling methods as well as coolants for electronics is provided, summarizing traditional coolants, heat transfer properties and performances of potential new coolants such as nanofluids are also reviewed and analyzed.
Journal ArticleDOI
Review of micro- and mini-channel heat sinks and heat exchangers for single phase fluids
Tisha Dixit,Indranil Ghosh +1 more
TL;DR: In this paper, a review of micro-and minichannel heat exchangers as heat sinks and heat exchanger has been presented, and the persisting lacunae of this technology drawn from the review have been pointed out.
Journal ArticleDOI
Aquasar: A hot water cooled data center with direct energy reuse
Severin Zimmermann,Severin Zimmermann,Ingmar Meijer,Manish K. Tiwari,Stephan Paredes,Bruno Michel,Dimos Poulikakos +6 more
TL;DR: In this paper, the authors report the energy and exergy efficiencies of Aquasar, the first hot water cooled supercomputer prototype, and establish hot water as a better coolant compared to air.
Journal ArticleDOI
Scale effects on flow boiling heat transfer in microchannels: A fundamental perspective
TL;DR: In this paper, a scaling analysis is presented to identify the relative effects of different forces on the boiling process at microscale, and the flow pattern transitions and stability for flow boiling of water and FC-77 are evaluated.
References
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Proceedings ArticleDOI
Effect of Manifold Design on Flow Distribution in Parallel Micro-Channels
TL;DR: In this article, the authors proposed that the apparent discrepancies of friction in multiple micro-channels can be attributed to flow mal-distribution, which can be minimized by proper header design and better manufacturing tolerances.