Journal ArticleDOI
A Practical Implementation of Silicon Microchannel Coolers for High Power Chips
Evan G. Colgan,Bruce K. Furman,Michael A. Gaynes,W. Graham,Nancy C. LaBianca,John H. Magerlein,Robert J. Polastre,M.B. Rothwell,Raschid J. Bezama,Rehan Choudhary,Kenneth C. Marston,Hilton T. Toy,Jamil A. Wakil,Jeffrey A. Zitz,Roger R. Schmidt +14 more
TLDR
In this paper, the authors describe a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors, which is able to cool chips with average power densities of 400W/cm2 or more.Abstract:
This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm2 /W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of <35kPa. Further, cooling of a thermal test chip with a microchannel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300W/cm2. Coolers of this design should be able to cool chips with average power densities of 400W/cm2 or moreread more
Citations
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Journal ArticleDOI
Device-Level Thermal Management of Gallium Oxide Field-Effect Transistors
TL;DR: In this article, a 3D coupled electrothermal model was constructed based on the electrical and thermal characterization results of a MOSFET fabricated via homoepitaxy.
Journal ArticleDOI
Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering
Daniel Lorenzini,Craig E. Green,Thomas E. Sarvey,Xuchen Zhang,Yuanchen Hu,Andrei G. Fedorov,Muhannad S. Bakir,Yogendra Joshi +7 more
TL;DR: In this paper, a thermal device vehicle (TDV) is proposed for a range of operating conditions, in which the surface area is locally increased by clustering a dense array of pin fins in the hotspot region for one configuration, while for the other the clustering is uniform in the spanwise direction.
Journal ArticleDOI
A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity
Yifeng Fu,Nabi Nabiollahi,Teng Wang,Shun Wang,Zhili Hu,Björn Carlberg,Yan Zhang,Xiaojing Wang,Johan Liu +8 more
TL;DR: Experimental results show that water is much more efficient than air as a cooling medium due to its three orders-of-magnitude higher heat capacity.
Journal ArticleDOI
Numerical Analysis of Novel Micro Pin Fin Heat Sink With Variable Fin Density
TL;DR: In this article, a novel design with variable fin density is proposed to generate a more uniform temperature of the IC chip junctions, which allows the gradual increase of the heat transfer area as coolant passes through the system.
Journal ArticleDOI
A simulation and experimental study of fluid flow and heat transfer on cylindrical oblique-finned heat sink
TL;DR: In this paper, a cylindrical oblique fin minichannel heat sink was proposed to fit over cylinrical heat sources in the form of an enveloping jacket, which decreases the average thermal boundary layer thickness, enhances the heat transfer performance and yields negligible pressure drop penalty due to combined effect of thermal boundary layers re-development and flow mixing.
References
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Journal ArticleDOI
High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Journal ArticleDOI
Challenges, developments and applications of silicon deep reactive ion etching
F. Laermer,A. Urban +1 more
TL;DR: In this article, an optimized hardware for balanced RF drive at high power levels (3 kW) of the inductive plasma source in combination with spatial ion discrimination and collimation yields etch-rates in excess of 10 µm/min with excellent uniformity of profile and rate distribution.
Proceedings ArticleDOI
Micro-channel heat exchanger optimization
G.M. Harpole,J.E. Eninger +1 more
TL;DR: In this article, a complete two-dimensional flow/thermal model of the micro-channel cooler was developed, and the design parameters were optimized for the case of a 1 kW/cm/sup 2/ heat flux with the top surface at 25 degrees C.
Proceedings ArticleDOI
Single-Phase Heat Transfer Enhancement Techniques in Microchannel and Minichannel Flows
TL;DR: In this article, the applicability of single-phase heat transfer enhancement techniques for microchannels and minichannels is evaluated, where the major techniques include flow transition, boundary layer, entrance region, vibration, electric fields, swirl flow, secondary flow and mixers.
Journal ArticleDOI
Cooling characteristics of diamond-shaped interrupted cooling fin for high-power LSI devices
T. Kishimoto,S. Saski +1 more
TL;DR: In this paper, a diamond-shaped interrupted microgrooved cooling fin was proposed to decrease the junction temperature variation across the chip, and the analytical results indicated that the reduction in junction temperature was less than 25% compared with a conventional paralles-plate-shaped cooling fin.