Open AccessBook
Algorithms for VLSI Physical Design Automation
TLDR
This book is a core reference for graduate students and CAD professionals and presents a balance of theory and practice in a intuitive manner.Abstract:
From the Publisher:
This work covers all aspects of physical design. The book is a core reference for graduate students and CAD professionals. For students, concept and algorithms are presented in an intuitive manner. For CAD professionals, the material presents a balance of theory and practice. An extensive bibliography is provided which is useful for finding advanced material on a topic. At the end of each chapter, exercises are provided, which range in complexity from simple to research level.read more
Citations
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Patent
Cell placement alteration apparatus for integrated circuit chip physical design automation system
TL;DR: In this article, a large number of possible placements of cells on an integrated circuit chip are generated and evaluated to determine the placement with the highest fitness, based on the fitness of each cell.
Dissertation
Design automation and analysis of three-dimensional integrated circuits
TL;DR: This thesis examines precisely how thermal behavior scales in 3-D integration and determines quantitatively how the temperature may be controlled during the circuit placement process and explores two issues for the future of 3- D integration.
Patent
Hexagonal DRAM array
Michael D. Rostoker,James S. Koford,Ranko Scepanovic,Edwin R. Jones,Gobi R. Padmanahben,Ashok K. Kapoor,Valeriy B. Kudryavtsev,Alexander E. Andreev,Stanislav V. Aleshin,Alexander S. Podkolzin +9 more
TL;DR: In this article, a tri-directional three-layer metal routing is proposed for hexagonal-shaped cells, where the conductors for interconnecting terminals of microelectronic cells of an integrated circuit are preferrably formed in three different layers.
Proceedings ArticleDOI
Systematic temperature sensor allocation and placement for microprocessors
TL;DR: This paper proposes novel optimization techniques for determining the optimal locations and allocations for thermal sensors to provide a high fidelity thermal profile of a complex microprocessor system.
Journal ArticleDOI
A Simulated Annealing-Based Approach to Three-Dimensional Component Packing
Simon Szykman,Jonathan Cagan +1 more
TL;DR: In this paper, a simulated annealing-based approach to three-dimensional component packing is presented, where the authors employ simulated annesaling to generate optimal solutions for VLSI circuits.
References
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Journal ArticleDOI
Optimization by Simulated Annealing
TL;DR: There is a deep and useful connection between statistical mechanics and multivariate or combinatorial optimization (finding the minimum of a given function depending on many parameters), and a detailed analogy with annealing in solids provides a framework for optimization of very large and complex systems.
Journal ArticleDOI
Equation of state calculations by fast computing machines
TL;DR: In this article, a modified Monte Carlo integration over configuration space is used to investigate the properties of a two-dimensional rigid-sphere system with a set of interacting individual molecules, and the results are compared to free volume equations of state and a four-term virial coefficient expansion.
Journal ArticleDOI
A note on two problems in connexion with graphs
TL;DR: A tree is a graph with one and only one path between every two nodes, where at least one path exists between any two nodes and the length of each branch is given.
Journal ArticleDOI
Combinatorial optimization: algorithms and complexity
TL;DR: This clearly written, mathematically rigorous text includes a novel algorithmic exposition of the simplex method and also discusses the Soviet ellipsoid algorithm for linear programming; efficient algorithms for network flow, matching, spanning trees, and matroids; the theory of NP-complete problems; approximation algorithms, local search heuristics for NPcomplete problems, more.