Proceedings ArticleDOI
Direct Liquid Jet-Impingment Cooling With Micron-Sized Nozzle Array and Distributed Return Architecture
Thomas Brunschwiler,Hugo E. Rothuizen,Matteo Fabbri,Urs Kloter,Bruno Michel,Raschid J. Bezama,Govindarajan Natarajan +6 more
- pp 196-203
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TLDR
In this paper, the authors demonstrate submerged single-phase direct liquid-jet-impingement cold plates that use arrays of jets with diameters in the range of 31 to 126 mum and cell pitches from 100 to 500 mum for high power-density microprocessor cooling applications.Abstract:
We demonstrate submerged single-phase direct liquid-jet-impingement cold plates that use arrays of jets with diameters in the range of 31 to 126 mum and cell pitches from 100 to 500 mum for high power-density microprocessor cooling applications. Using parallel inlet and outlet manifolds, a distributed return concept for easy scaling to 40,000 cells on an area of 4 cm was implemented. Pressure drops < 0.1 bar at 2.5 1/min flow rate have been reached with a hierarchical tree-like double-branching manifold. Experiments were carried out with water jets having Reynolds numbers smaller than 900 at nozzle to heater gaps ranging between 3 to 300 mum. We identified four flow regimes, namely, pinch-off, transition, impingement, and separation, with different influences on heat-removal and pressure-drop characteristics. Parametric analysis resulted in an optimal heat-removal rate of 420 W/cm2 using water as a coolant. For a near optimal design with a gap to inlet diameter ratio of 1.2, we measured a heat-transfer coefficient of 8.7 W/cm2 K and a junction to inlet fluid unit thermal resistance of 0.17 Kcm2 /W (720 mum chip), which is equivalent to a 370 W/cm2 cooling performance at a junction to inlet fluid temperature rise of 63 degC, a pressure drop of 0.35 bar, and a flow rate of 2.5 1/minread more
Citations
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Journal ArticleDOI
State of the Art of High Heat Flux Cooling Technologies
TL;DR: In this paper, a literature review is presented to compare different cooling technologies currently in development in research laboratories that are competing to solve the challenge of cooling the next generation of high heat flux computer chips.
Journal ArticleDOI
A Hierarchical Manifold Microchannel Heat Sink Array for High-Heat-Flux Two-Phase Cooling of Electronics
Kevin P. Drummond,Doosan Back,Michael D. Sinanis,David B. Janes,Dimitrios Peroulis,Justin A. Weibel,Suresh V. Garimella +6 more
TL;DR: In this article, a hierarchical manifold micro-channel heat sink array is used to reduce the parasitic thermal resistances due to contact and conduction resistances, which can reduce the chip footprint area and shorten effective fluid flow lengths.
Journal ArticleDOI
Aquasar: A hot water cooled data center with direct energy reuse
Severin Zimmermann,Severin Zimmermann,Ingmar Meijer,Manish K. Tiwari,Stephan Paredes,Bruno Michel,Dimos Poulikakos +6 more
TL;DR: In this paper, the authors report the energy and exergy efficiencies of Aquasar, the first hot water cooled supercomputer prototype, and establish hot water as a better coolant compared to air.
Journal ArticleDOI
Interlayer cooling potential in vertically integrated packages
Thomas Brunschwiler,Bruno Michel,Hugo E. Rothuizen,Urs Kloter,Bernhard Wunderle,Hermann Oppermann,Herbert Reichl +6 more
TL;DR: In this paper, the heat-removal capability of area-interconnect-compatible interlayer cooling in vertically integrated, high-performance chip stacks was characterized with de-ionized water as coolant.
Proceedings ArticleDOI
Forced convective interlayer cooling in vertically integrated packages
Thomas Brunschwiler,Bruno Michel,Hugo E. Rothuizen,Urs Kloter,Bernhard Wunderle,Hermann Oppermann,Herbert Reichl +6 more
TL;DR: In this article, the heat removal capability of area-interconnect-compatible interlayer cooling in vertically integrated, high-performance chip stacks was characterized with de-ionized water as coolant.
References
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Book ChapterDOI
Heat and Mass Transfer between Impinging Gas Jets and Solid Surfaces
TL;DR: In this article, the authors present a comprehensive survey emphasizing the engineering applications and empirical equations, presented for the prediction of heat and mass transfer coefficients within a large and technologically important range of variables.
Book ChapterDOI
Single-Phase Liquid Jet Impingement Heat Transfer
Brent W. Webb,C. F. Ma +1 more
TL;DR: In this article, the authors summarized the available analytical and experimental work in the area with the objective of correlating the research findings and suggested that there is considerable need for further research in liquid jet array applications, both in submerged and free-surface jet configurations.
Journal ArticleDOI
Heat transfer and pressure drop in fractal tree-like microchannel nets
Yongping Chen,Ping Cheng +1 more
TL;DR: Inspired by the fractal pattern of mammalian circulatory and respiratory systems, a new design of fractal branching channel net for cooling of electronic chips is studied in this article, which has a stronger heat transfer capability and requires a lower pumping power.
Journal ArticleDOI
Laminar mixing, heat transfer and pressure drop in tree-like microchannel nets and their application for thermal management in polymer electrolyte fuel cells
S.M. Senn,Dimos Poulikakos +1 more
TL;DR: In this paper, the laminar convective heat transfer and pressure drop characteristics in tree-like microchannel nets are numerically investigated and compared to the corresponding characteristics in traditional serpentine flow patterns, by solving the Navier-Stokes and energy equation for an incompressible fluid with constant properties in three dimensions.