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Proceedings ArticleDOI

Direct Liquid Jet-Impingment Cooling With Micron-Sized Nozzle Array and Distributed Return Architecture

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TLDR
In this paper, the authors demonstrate submerged single-phase direct liquid-jet-impingement cold plates that use arrays of jets with diameters in the range of 31 to 126 mum and cell pitches from 100 to 500 mum for high power-density microprocessor cooling applications.
Abstract
We demonstrate submerged single-phase direct liquid-jet-impingement cold plates that use arrays of jets with diameters in the range of 31 to 126 mum and cell pitches from 100 to 500 mum for high power-density microprocessor cooling applications. Using parallel inlet and outlet manifolds, a distributed return concept for easy scaling to 40,000 cells on an area of 4 cm was implemented. Pressure drops < 0.1 bar at 2.5 1/min flow rate have been reached with a hierarchical tree-like double-branching manifold. Experiments were carried out with water jets having Reynolds numbers smaller than 900 at nozzle to heater gaps ranging between 3 to 300 mum. We identified four flow regimes, namely, pinch-off, transition, impingement, and separation, with different influences on heat-removal and pressure-drop characteristics. Parametric analysis resulted in an optimal heat-removal rate of 420 W/cm2 using water as a coolant. For a near optimal design with a gap to inlet diameter ratio of 1.2, we measured a heat-transfer coefficient of 8.7 W/cm2 K and a junction to inlet fluid unit thermal resistance of 0.17 Kcm2 /W (720 mum chip), which is equivalent to a 370 W/cm2 cooling performance at a junction to inlet fluid temperature rise of 63 degC, a pressure drop of 0.35 bar, and a flow rate of 2.5 1/min

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Citations
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Journal ArticleDOI

State of the Art of High Heat Flux Cooling Technologies

TL;DR: In this paper, a literature review is presented to compare different cooling technologies currently in development in research laboratories that are competing to solve the challenge of cooling the next generation of high heat flux computer chips.
Journal ArticleDOI

A Hierarchical Manifold Microchannel Heat Sink Array for High-Heat-Flux Two-Phase Cooling of Electronics

TL;DR: In this article, a hierarchical manifold micro-channel heat sink array is used to reduce the parasitic thermal resistances due to contact and conduction resistances, which can reduce the chip footprint area and shorten effective fluid flow lengths.
Journal ArticleDOI

Aquasar: A hot water cooled data center with direct energy reuse

TL;DR: In this paper, the authors report the energy and exergy efficiencies of Aquasar, the first hot water cooled supercomputer prototype, and establish hot water as a better coolant compared to air.
Journal ArticleDOI

Interlayer cooling potential in vertically integrated packages

TL;DR: In this paper, the heat-removal capability of area-interconnect-compatible interlayer cooling in vertically integrated, high-performance chip stacks was characterized with de-ionized water as coolant.
Proceedings ArticleDOI

Forced convective interlayer cooling in vertically integrated packages

TL;DR: In this article, the heat removal capability of area-interconnect-compatible interlayer cooling in vertically integrated, high-performance chip stacks was characterized with de-ionized water as coolant.
References
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Journal ArticleDOI

A and V.

Book ChapterDOI

Heat and Mass Transfer between Impinging Gas Jets and Solid Surfaces

TL;DR: In this article, the authors present a comprehensive survey emphasizing the engineering applications and empirical equations, presented for the prediction of heat and mass transfer coefficients within a large and technologically important range of variables.
Book ChapterDOI

Single-Phase Liquid Jet Impingement Heat Transfer

TL;DR: In this article, the authors summarized the available analytical and experimental work in the area with the objective of correlating the research findings and suggested that there is considerable need for further research in liquid jet array applications, both in submerged and free-surface jet configurations.
Journal ArticleDOI

Heat transfer and pressure drop in fractal tree-like microchannel nets

TL;DR: Inspired by the fractal pattern of mammalian circulatory and respiratory systems, a new design of fractal branching channel net for cooling of electronic chips is studied in this article, which has a stronger heat transfer capability and requires a lower pumping power.
Journal ArticleDOI

Laminar mixing, heat transfer and pressure drop in tree-like microchannel nets and their application for thermal management in polymer electrolyte fuel cells

TL;DR: In this paper, the laminar convective heat transfer and pressure drop characteristics in tree-like microchannel nets are numerically investigated and compared to the corresponding characteristics in traditional serpentine flow patterns, by solving the Navier-Stokes and energy equation for an incompressible fluid with constant properties in three dimensions.
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