Journal ArticleDOI
Electromagnetic interference (EMI) of system-on-package (SOP)
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TLDR
In this paper, the authors discuss the design and development of system-on-package (SOP) integrated high-performance digital LSIs and for radio frequency (RF) and analog circuits.Abstract:
Electromagnetic interference (EMI) issues are expected to be crucial for next-generation system-on-package (SOP) integrated high-performance digital LSIs and for radio frequency (RF) and analog circuits. Ordinarily in SOPs, high-performance digital LSIs are sources of EMI, while RF and analog circuits are affected by EMI (victims). This paper describes the following aspects of EMI in SOPs: 1) die/package-level EMI; 2) substrate-level EMI; 3) electromagnetic modeling and simulation; and 4) near electromagnetic field measurement. First, LSI designs are discussed with regard to radiated emission. The signal-return path loop and switching current in the power/ground line are inherent sources of EMI. The EMI of substrate, which work as coupling paths or unwanted antennas, is described. Maintaining the return current path is an important aspect of substrate design for suppressing EMI and for maintaining signal integrity (SI). In addition, isolating and suppressing the resonance of the DC power bus in a substrate is another important design aspect for EMI and for power integrity (PI). Various electromagnetic simulation methodologies are introduced as indispensable design tools for achieving high-performance SOPs without EMI problems. Measurement techniques for near electric and magnetic fields are explained, as they are necessary to confirm the appropriateness of designs and to investigate the causes of EMI problems. This paper is expected to be useful in the design and development of SOPs that take EMI into consideration.read more
Citations
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Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation
TL;DR: In this article, the authors reviewed possible solutions based on decoupling or isolation for suppressing power distribution network (PDN) noise on package or printed circuit board (PCB) levels.
Journal ArticleDOI
Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress
TL;DR: The fundamentals and latest progress of modeling, analysis, and design technologies for signal integrity and electromagnetic compatibility on PCB and package in the past decades are reviewed and the necessity of practical training of designers is mentioned.
Journal ArticleDOI
PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models
Jun So Pak,Joohee Kim,Jonghyun Cho,Kiyeong Kim,Taigon Song,Seungyoung Ahn,Jun Ho Lee,Hyungdong Lee,Kunwoo Park,Joungho Kim +9 more
TL;DR: In this article, a power/ground (P/G) TSV array model based on separated P/G TSV and chip-PDN models at frequencies up to 20 GHz is proposed for estimating the PDN impedances of 3D TSV ICs.
Journal ArticleDOI
EMI Reduction via Spread Spectrum in DC/DC Converters: State of the Art, Optimization, and Tradeoffs
TL;DR: The most common and most efficient known spreading techniques are considered, looking for spreading parameters that ensure the highest EMI reduction and the lowest performance reduction in the circuit where the spreading is applied.
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Poly(vinylidene fluoride)-based flexible and lightweight materials for attenuating microwave radiations.
TL;DR: This study open new avenues to design flexible and lightweight electromagnetic interference shielding materials by careful selection of functional nanoparticles in poly(vinylidene fluoride) (PVDF)-based composites.
References
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Power bus isolation using power islands in printed circuit boards
TL;DR: In this paper, the authors investigate the effectiveness of several power island structures up to 3.0 GHz and show that the amount of isolation depends on the type of connection between power islands and the components on the board.
Proceedings ArticleDOI
Separated role of on-chip and on-PCB decoupling capacitors for reduction of radiated emission on printed circuit board
Jonghoon J. Kim,Baekkyu Choi,Hyungsoo Kim,Woonghwan Ryu,Young-hwan Yun,Seog-Heon Ham,Soo-Hyung Kim,Yong-Hee Lee,Joungho Kim +8 more
TL;DR: In this paper, the role of on-PCB and on-chip decoupling capacitors on the suppression of electromagnetic radiated emission was discussed, and it was found that the decoupled capacitors are mainly effective for the suppression over 100 MHz frequency.
Proceedings ArticleDOI
High frequency magnetic near field measurement on LSI chip using planar multi-layer shielded loop coil
TL;DR: In measuring nonuniform magnetic field distribution near the 1.58 mm-wide microstrip line and the internal chip of a large-scale integrated (LSI) circuit, the new model could measure a finer distribution than the previous probe.
BookDOI
Signal Integrity Effects in Custom IC and ASIC Designs
TL;DR: Signal Integrity Effects in Custom IC and ASIC Designs compiles recent expert research papers in state-of-the-art IC (Integrated Circuits) design and offers a detailed focus on all the major topics in understanding and modeling real-world IC signal integrity issues for CAD and IC design engineers, as well as graduate engineering students.
Proceedings ArticleDOI
Electromagnetic radiation properties of a printed circuit board with a slot in the ground plane
Y. Ko,K. Ito,J. Kudo,Toshio Sudo +3 more
TL;DR: In this article, the electromagnetic radiation simulation and measurement of a simplified printed circuit board (PCB) is described, and the authors have confirmed that the proposed method of placing a bypass capacitor across the slot is effective to suppress the radiated emission.