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Journal ArticleDOI

High-performance half-Heusler thermoelectric devices through direct bonding technique

TLDR
In this paper, high temperature brazing material is used as a filler that enables direct bonding of TE legs to the copper electrode without metallizing legs, which improves the TEG performance and stability at high temperatures by minimizing the contact resistance and diffusion at TE leg/electrode interface.
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This article is published in Journal of Power Sources.The article was published on 2021-05-01. It has received 17 citations till now. The article focuses on the topics: Thermoelectric effect & Thermoelectric generator.

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Citations
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Journal ArticleDOI

Advances in half-Heusler alloys for thermoelectric power generation

TL;DR: In this article, a review summarises recent progress for the main classes of half-Heusler alloys, including their fundamental electronic and thermal properties, processing, and thermoelectric performance, and some of the expanding body of work focused on translating materials performance (zT > 1 at 773 K is now routinely possible) into generator devices.
Journal Article

NbFeSb based p-type half-Heusler for power generation applications

TL;DR: In this article, a peak dimensionless figure-of-merit (ZT) of ∼1 at 700 °C in a nanostructured p-type Nb0.05 composition is reported.
Journal Article

Achieving high power factor and output power density in p-type half-Heuslers Nb

TL;DR: In this paper, the authors achieved a peak power factor of ∼106 μW⋅cm−1⋆K−2 by increasing the hot pressing temperature up to 1,373 K in the p-type half-Heusler Nb0.95Ti0.05FeSb.
Journal ArticleDOI

Thermoelectric coolers for high-power-density 3D electronics heat management

TL;DR: In this article , the design of TECs for electronics cooling using a computational model and then experimentally validate the main predictions was provided, and it was shown that it is possible to achieve high cooling power density through optimization of TE leg height and packing density.
Journal ArticleDOI

Lattice Distortions and Multiple Valence Band Convergence Contributing to High Thermoelectric Performance in MnTe.

TL;DR: In this paper , a new route is proposed for the minimization of lattice thermal conductivity in MnTe through considerable increasing phonon scattering by introducing dense lattice distortions, which can be induced by Cu and Ag dopants possessing large differences in atom radius with host elements.
References
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Journal ArticleDOI

Complex thermoelectric materials.

TL;DR: A new era of complex thermoelectric materials is approaching because of modern synthesis and characterization techniques, particularly for nanoscale materials, and the strategies used to improve the thermopower and reduce the thermal conductivity are reviewed.
Journal ArticleDOI

High-Thermoelectric Performance of Nanostructured Bismuth Antimony Telluride Bulk Alloys

TL;DR: Electrical transport measurements, coupled with microstructure studies and modeling, show that the ZT improvement is the result of low thermal conductivity caused by the increased phonon scattering by grain boundaries and defects, which makes these materials useful for cooling and power generation.
Journal ArticleDOI

Ultralow thermal conductivity and high thermoelectric figure of merit in SnSe crystals

TL;DR: An unprecedented ZT of 2.6 ± 0.3 at 923 K is reported in SnSe single crystals measured along the b axis of the room-temperature orthorhombic unit cell, which highlights alternative strategies to nanostructuring for achieving high thermoelectric performance.
Journal ArticleDOI

Enhanced thermoelectric figure-of-merit in nanostructured p-type silicon germanium bulk alloys.

TL;DR: A dimensionless thermoelectric figure-of-merit (ZT) of 0.95 in p-type nanostructured bulk silicon germanium (SiGe) alloys is achieved, which is about 90% higher than what is currently used in space flight missions, and half higher than the reported record.
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