Journal ArticleDOI
Lead-free Solders in Microelectronics
Mulugeta Abtew,Guna S Selvaduray +1 more
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TLDR
The most widely used Pb-free solders have the eutectic composition as mentioned in this paper, which has been identified as a major factor affecting alloy selection, since this will have a major impact on the other polymeric materials used in microelectronic assembly and encapsulation.Abstract:
Practically all microelectronic assemblies in use today utilize Pb–Sn solders for interconnection. With the advent of chip scale packaging technologies, the usage of solder connections has increased. The most widely used Pb–Sn solder has the eutectic composition. Emerging environmental regulations worldwide, most notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has made the search for suitable “Pb-free” solders an important issue for microelectronics assembly. Approximately 70 Pb-free solder alloy compositions have been proposed thus far. There is a general lack of engineering information, and there is also significant disparity in the information available on these alloys. The issues involved can be divided into two broad categories: manufacturing and reliability/performance. A major factor affecting alloy selection is the melting point of the alloy, since this will have a major impact on the other polymeric materials used in microelectronic assembly and encapsulation. Other important manufacturing issues are cost, availability, and wetting characteristics. Reliability related properties include mechanical strength, fatigue resistance, coefficient of thermal expansion and intermetallic compound formation. The data available in the open literature have been reviewed and are summarized in this paper. Where data were not available, such as for corrosion and oxidation resistance, chemical thermodynamics was used to develop this information. While a formal alloy selection decision analysis methodology has not been developed, less formal approaches indicate that Sn-rich alloys will be the Pb-free solder alloys of choice, with three to four alloys being identified for each of the different applications. Research on this topic continues at the present time at a vigorous pace, in view of the imminence of the issue.read more
Citations
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Journal ArticleDOI
Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect
TL;DR: In this article, the intermetallic compound (IMC) growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints were studied, respectively, after they were aged at 160-210°C for different time.
Journal ArticleDOI
Review of the wettability of solder with a wetting balance test for recent advanced microelectronic packaging
Do-Hyun Jung,Jae Pil Jung +1 more
TL;DR: In this paper, the wetting properties of solder for microelectronic packaging were reviewed and the recent demand for high-density packaging has highlighted the need for a sophisticated and improved solder.
Journal ArticleDOI
Influence of ZnO nano-particles addition on thermal analysis, microstructure evolution and tensile behavior of Sn–5.0 wt% Sb–0.5 wt% Cu lead-free solder alloy
A.N. Fouda,E.A. Eid +1 more
TL;DR: In this paper, the effect of adding ZnO nano-metric particles to plain SSC505 solder was investigated and a slight increment in the melting temperature was recorded using differential scanning calorimetry (DSC) after addition of ZNO.
Journal ArticleDOI
The atomic-scale studies of the behavior of the crystal dissolution in a molten metal
Chang-Ho Yu,Kwang-Lung Lin +1 more
TL;DR: In this paper, the early atomic-scale dissolution behavior of Cu in a molten pure Sn was studied by transmission electron microscope (TEM), and the innermost region adjacent to the Cu lattice is an amorphous Cu-Sn diffusion zone that contains dispersed e-Cu 3 Sn nanocrystalline cells.
Journal ArticleDOI
A Comparative Study of Reactive Wetting of Lead and Lead-Free Solders on Cu and (Cu6Sn5/Cu3Sn)/Cu Substrates
TL;DR: In this paper, the authors investigated the reaction time of solders on Cu and Cu 6 Sn 5 /Cu 3 Sn/Cu substrates using both the wetting balance, and the hot-stage visualization of the triple-line movement.
References
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