Journal ArticleDOI
Lead-free Solders in Microelectronics
Mulugeta Abtew,Guna S Selvaduray +1 more
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TLDR
The most widely used Pb-free solders have the eutectic composition as mentioned in this paper, which has been identified as a major factor affecting alloy selection, since this will have a major impact on the other polymeric materials used in microelectronic assembly and encapsulation.Abstract:
Practically all microelectronic assemblies in use today utilize Pb–Sn solders for interconnection. With the advent of chip scale packaging technologies, the usage of solder connections has increased. The most widely used Pb–Sn solder has the eutectic composition. Emerging environmental regulations worldwide, most notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has made the search for suitable “Pb-free” solders an important issue for microelectronics assembly. Approximately 70 Pb-free solder alloy compositions have been proposed thus far. There is a general lack of engineering information, and there is also significant disparity in the information available on these alloys. The issues involved can be divided into two broad categories: manufacturing and reliability/performance. A major factor affecting alloy selection is the melting point of the alloy, since this will have a major impact on the other polymeric materials used in microelectronic assembly and encapsulation. Other important manufacturing issues are cost, availability, and wetting characteristics. Reliability related properties include mechanical strength, fatigue resistance, coefficient of thermal expansion and intermetallic compound formation. The data available in the open literature have been reviewed and are summarized in this paper. Where data were not available, such as for corrosion and oxidation resistance, chemical thermodynamics was used to develop this information. While a formal alloy selection decision analysis methodology has not been developed, less formal approaches indicate that Sn-rich alloys will be the Pb-free solder alloys of choice, with three to four alloys being identified for each of the different applications. Research on this topic continues at the present time at a vigorous pace, in view of the imminence of the issue.read more
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Journal ArticleDOI
Effect of Pd thickness on wettability and interfacial reaction of Sn-1.0Ag-Ce solders on ENEPIG surface finish
Q. V. Bui,Seung-Boo Jung +1 more
TL;DR: The wetting balance test was used to study the wettability of Sn-1.0Ag-Ce (Ce content) solder alloys on electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finishes.
Dissertation
Etude de l’impact de micro-cavités (voids) dans les attaches de puces des modules électroniques de puissance
TL;DR: In this article, the authors evaluate the pertinence of a methodologie basee sur la confrontation of simulations numeriques and de campagnes experimentales, which minimizes le nombre de simulations.
Journal ArticleDOI
In-situ observations on fracture behaviors of Cu-Sn IMC layers induced by deformation of Cu substrates
Qingke Zhang,Z.F. Zhang +1 more
TL;DR: In this paper, the fracture behaviors of the interfacial Cu-sn intermetallic compound (IMC) layers induced by deformation of the Cu substrates were investigated, and the fracture morphologies were in situ observed.
Journal ArticleDOI
Performance and reliability of Al2O3 nanoparticles doped multicomponent Sn-3.0Ag-0.5Cu-Ni-Ge solder alloy
Sanjay Tikale,K. Narayan Prabhu +1 more
TL;DR: In this paper, the effect of Al2O3 nanoparticles addition on melting, microhardness, microstructural, and mechanical properties of multicomponent Sn-3Ag-0.5Cu- 0.01Ge (SACNiGe) solder alloy was investigated and the reliability of the joint was determined using Weibull analysis.
Journal ArticleDOI
Microstructure and Mechanical Properties of Tin-Bismuth Solder Reinforced by Aluminum Borate Whiskers
TL;DR: In this article, the microstructure and mechanical performance of tin-bismuth solder joints were improved by adding 3.2 vol.% aluminum borate whiskers to the tin bismuth alloy.
References
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