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Journal ArticleDOI

Trends in power semiconductor devices

TLDR
In this paper, the authors review recent trends in power semiconductor device technology that are leading to improvements in power losses for power electronic systems and predict that silicon carbide based switches will begin to displace these silicon devices.
Citations
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Patent

Power Semiconductor Devices

TL;DR: This invention generally relates to power semiconductor devices, and in particular to improved thyristor devices and circuits, which are particularly useful for so-called MOS-gated thyristors.
Journal ArticleDOI

Enhancement of breakdown voltage in AlGaN/GaN high electron mobility transistors using a field plate

TL;DR: In this paper, the authors investigated the breakdown (V/sub br/) enhancement potential of the field plate (FP) technique in the context of AlGaN/GaN power HEMTs.
Journal ArticleDOI

High breakdown voltage AlGaN-GaN power-HEMT design and high current density switching behavior

TL;DR: AlGaN-GaN power high-electron mobility transistors (HEMTs) with 600-V breakdown voltage are fabricated and demonstrated as switching power devices for motor drive and power supply applications.
Journal ArticleDOI

Reliability and performance limitations in SiC power devices

TL;DR: The performance and reliability issues unique to SiC discussed here include: (a) MOS channel conductance/gate dielectric reliability trade-off due to lower channel mobility as well as SiC–SiO2 barrier lowering due to interface traps; (b) reduction in breakdown field and increased leakageCurrent due to material defects; and (c) increased leakage current in SiC Schottky devices at high temperatures.
Journal ArticleDOI

Energy, environment, and advances in power electronics

TL;DR: In this paper, a review of the recent advances of power electronics that includes power semiconductor devices, converters, machines, drives and control is incorporated in the paper, and a prognosis for the 21st century has been outlined.
References
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Journal ArticleDOI

Comparison of 6H-SiC, 3C-SiC, and Si for power devices

TL;DR: In this paper, the drift region properties of 6H- and 3C-SiC-based Schottky rectifiers and power MOSFETs that result in breakdown voltages from 50 to 5000 V are defined.
Journal ArticleDOI

Power semiconductor device figure of merit for high-frequency applications

TL;DR: In this paper, the authors derived the Baliga high-frequency figure of merit for power semiconductor devices operating in high frequency circuits and showed that significant performance improvement can be achieved by replacing silicon with gallium arsenide, silicon carbide, or semiconducting diamond.
Patent

Power Semiconductor Devices

TL;DR: This invention generally relates to power semiconductor devices, and in particular to improved thyristor devices and circuits, which are particularly useful for so-called MOS-gated thyristors.
Journal ArticleDOI

Semiconductors for high‐voltage, vertical channel field‐effect transistors

TL;DR: In this paper, the influence of material parameters on the characteristics of vertical channel power field effect transistors is examined, and it is demonstrated that for devices with the same breakdown voltage and device structure, the onresistance is inversely proportional to the third power of the energyband gap and inversely proportion to the mobility.