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Institution

International Rectifier

CompanyWrexham, Wales [Cymru GB-CYM], United Kingdom
About: International Rectifier is a company organization based out in Wrexham, Wales [Cymru GB-CYM], United Kingdom. It is known for research contribution in the topics: Power semiconductor device & Transistor. The organization has 767 authors who have published 1624 publications receiving 27118 citations.


Papers
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Patent
06 Apr 2005
TL;DR: In this paper, a self-oscillating full-bridge driver IC is proposed, in which the high-side drivers each have a bootstrap capacitor, and a bootstrapping circuit for precharging the bootstrap capacitors before starting up the oscillator or supplying control signals to the high side drivers.
Abstract: A self-oscillating full-bridge driver IC, in which the high-side drivers each have a bootstrap capacitor, and a bootstrap circuit for pre-charging the bootstrap capacitors before starting up the oscillator or supplying control signals to the high-side drivers.

13 citations

Patent
22 Oct 2007
TL;DR: In this article, a DC-DC voltage converter has a switching stage including high and low-side switches connected in series at a switched node across a DC voltage bus; a control circuit; and a feedback loop connected between an output of the switching stage and an input of the control circuit.
Abstract: A DC-DC voltage converter having a switching stage including high- and low-side switches connected in series at a switched node across a DC voltage bus; a control circuit; and a feedback loop connected between an output of the switching stage and an input of the control circuit, the control circuit having a clock signal input and including an error processing circuit coupled to the input for detecting an output of the feedback loop, the control circuit turning OFF the low-side switch and turning ON the high-side switch when the clock signal is detected. The control circuit operates in a cycle-by-cycle operation generating PWM modulation synchronous to the external clock source.

13 citations

Patent
26 Oct 2001
TL;DR: In this article, a plastic housing of standard size, but contains a greater total silicon die area, is used to reduce thermal differential expansion and contraction stresses applied to the die from the lead frame pad.
Abstract: Semiconductor die are soldered or epoxy bonded to lead frame pads and overhang the pads to reduce thermal differential expansion and contraction stresses applied to the die from the lead frame pad. A plastic housing of standard size is unchanged in dimension, but contains a greater total silicon die area.

13 citations

Patent
21 Dec 1982
TL;DR: In this article, two identical power chips and the LED chip are spaced from one another and mounted on an alumina substrate, and two lead wires are stitch-bonded to the electrode pads of the two chips to connect them in anti-parallel relation.
Abstract: A solid state a.c. relay has two separate and indentical power thyristors connected in anti-parallel arrangement. The power thyristors are optically switched, lateral conduction devices with anode and cathode electrodes on the same surface. Both are switched by illuminating their surface by reflected illumination from an LED. Each thyristor is provided with a respective control circuit which includes a MOSFET transistor for clamping its respective thyristor gate wherever the voltage across the thryistor exceeds a given absolute value or whenever there is a high dV/dt transient across the thyristor. The control circuit for the control transistor includes a capacitance divider, one element of which is the distributed capacitance of the control transistor. The control circuit components can be integrated into the same semiconductor chip which contains the respective power thyristor. Each of the two identical power chips and the LED chip are spaced from one another and mounted on an alumina substrate. Two lead wires are stitch-bonded to the electrode pads of the two chips to connect them in anti-parallel relation, and are then stitch-bonded to two respective conductive sections on the alumina substrate. The chips and the LED are covered with a cap having a reflective interior so that illumination from the LED is reflected toward the chip surfaces. The interior of the cap is filled with a transparent plastic. The assembly is housed in either a single in-line pin housing or dual in-line pin housing and the entire housing is suitably encapsulated.

13 citations


Authors

Showing all 768 results

NameH-indexPapersCitations
Robert S. Brown130124365822
Praveen Jain5962711528
Edwin L. Piner421625020
Jerry W. Johnson371093522
Steffen Rupp361574848
Kevin J. Linthicum361174334
Andrei Vescan312073308
Thomas Gehrke28812753
Pradeep Rajagopal27652282
Thomas J. Ribarich24831547
Daniel M. Kinzer23822054
Bo Yang21403331
Johan Strydom21752159
Michael A. Briere191421200
Robert Joseph Therrien19561441
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Performance
Metrics
No. of papers from the Institution in previous years
YearPapers
20221
20201
20192
20183
20175
201611