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Journal ArticleDOI

A transmission electron microscopy quantitative study of the growth kinetics of H platelets in Si

TLDR
In this paper, the authors used transmission electron microscopy (TEM) to quantitatively study the thermal behavior of cavities and found that the cavities grow in size, reduce their density, while the overall volume they occupy remains constant.
Abstract
Proton implantation and thermal annealing of silicon result in the formation of a specific type of extended defects involving hydrogen, named “platelets” or “cavities.” These defects have been related to the exfoliation mechanism on which a newly developed process to transfer thin films of silicon onto various substrates is based. The density and the size of these platelets depend on the implantation and annealing conditions. In this letter, rigorous statistical methods based on transmission electron microscopy have been used to quantitatively study the thermal behavior of these defects. Upon annealing, it is shown that the cavities grow in size, reduce their density, while the overall volume they occupy remains constant. This phenomenon is due to a conservative ripening of the cavities. The transfer of hydrogen atoms from small to large cavities leads to a decrease of the elastic energy within the implanted layer while the strain locally increases around the projected range of the protons.

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Citations
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Journal ArticleDOI

Frontiers of silicon-on-insulator

TL;DR: In this article, the authors discuss methods of forming silicon-on-insulator (SOI) wafers, their physical properties, and the latest improvements in controlling the structure parameters.
Journal ArticleDOI

The generic nature of SmartCut process for thin film transfer

TL;DR: In this paper, a specific case of thermally-induced splitting is investigated, where the splitting kinetics are controlled by hydrogen diffusion. And the latest results concerning new structures are presented.
Journal ArticleDOI

Hydrogen blistering of silicon: Progress in fundamental understanding

TL;DR: A review of the most relevant experimental facts and their conformity with the data assessed can be found in this paper, where an attempt is made to identify the key questions and suggest a few avenues for future work.
Journal ArticleDOI

Mechanics of Smart-Cut ® technology

TL;DR: In this paper, a model for defect nucleation induced by hydrogen ion implantation is established based on the continuum mechanics theory accounting for the crystal structure of silicon, which is used to provide an upper bound on the implantation dose of hydrogen ions, one of the most important process parameter in the Smart-Cut technology.
Journal ArticleDOI

Orientation dependence of blistering in H-implanted Si

TL;DR: In this article, the orientation effect on the blistering phenomenon in H implanted Si wafers was studied for (100), (111), and (110) Si wafer, and it was found that substrate orientation has no observable effects on the underlying blistering mechanisms.
References
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Journal ArticleDOI

Silicon on insulator material technology

M. Bruel
- 06 Jul 1995 - 
TL;DR: In this article, a silicon on insulator material technology based on wafer bonding is described, in which a heat treatment induces an in-depth microslicing of one of the two bonded wafers previously implanted with hydrogen.
Journal ArticleDOI

Application of hydrogen ion beams to Silicon On Insulator material technology

TL;DR: In this article, a new application for proton ion beams in the field of Silicon On Insulator material (SOI) technology is reported, based on hydrophillic wafer bonding and referred to as Smart-Cut, heat treatment induces an in-depth micro-slicing of one of two bonded wafers previously implanted with hydrogen.
Journal ArticleDOI

On the mechanism of the hydrogen-induced exfoliation of silicon

TL;DR: In this paper, the fundamental mechanism underlying hydrogen-induced exfoliation of silicon, using a combination of spectroscopic and microscopic techniques, was investigated, and the evolution of the internal defect structure as a function of implanted hydrogen concentration and annealing temperature was studied.
Journal ArticleDOI

Layer splitting process in hydrogen-implanted Si, Ge, SiC, and diamond substrates

TL;DR: In this paper, an effective activation energy was determined for the formation of optically detectable surface blisters from the time required to form such blisters at various temperatures, and the measured effective activation energies are close to the respective bond energies in all four materials.
Journal ArticleDOI

Ostwald ripening of end-of-range defects in silicon

TL;DR: In this article, the authors show that the mean radius of the dislocation loops increases with time while their density decreases through the exchange of Si self-interstitial atoms between the loops, while the number of interstitials stored in the loops stays constant.
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