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Proceedings ArticleDOI

Evaluation and application of 600V GaN HEMT in cascode structure

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TLDR
In this paper, the characteristics and operation principles of 600V cascode GaN HEMT were studied and compared with state-of-the-art silicon MOSFET.
Abstract
Gallium nitride high electron mobility transistor (GaN HEMT) has matured dramatically over the last few years. More and more devices have been manufactured and field in applications ranging from low power voltage regulator to high power infrastructure base-stations. Compared to the state of art silicon MOSFET, GaN HEMT has much better figure of merit and is potential for high frequency application. In general, 600V GaN HEMT is intrinsically normally-on device. To easily apply depletion mode GaN HEMT in circuit design, a low voltage silicon MOSFET is in series to drive the GaN HEMT, which is well known as cascode structure. This paper studies the characteristics and operation principles of 600V cascode GaN HEMT. Evaluations of GaN HEMT performance based on Buck converter under hard-switching and soft-switching conditions are presented. Experimental results illustrate that GaN HEMT is superior than silicon MOSFET but still needs soft-switching in high frequency operation due to considerable package and layout parasitic inductors and capacitors. Then GaN HEMT is applied to a 1MHz 300W 400V/12V LLC converter. Comparison of experimental results with state of art silicon MOSFET is provided to validate the advantages of GaN HEMT.

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Citations
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Journal ArticleDOI

Design and Optimization of a 380–12 V High-Frequency, High-Current LLC Converter With GaN Devices and Planar Matrix Transformers

TL;DR: In this paper, a 1-MHz 1-kW LLC resonant converter using GaN devices and planar matrix transformers is proposed for data center data center applications, which achieves high-current, high-efficiency, and low-cost power solutions.
Journal ArticleDOI

GaN-based power devices: Physics, reliability, and perspectives

TL;DR: In this article, the authors describe the physics, technology, and reliability of GaN-based power devices, starting from a discussion of the main properties of the material, the characteristics of lateral and vertical GaN transistors are discussed in detail to provide guidance in this complex and interesting field.
Journal ArticleDOI

Investigation of Gallium Nitride Devices in High-Frequency LLC Resonant Converters

TL;DR: In this article, the authors investigated the benefits of gallium nitride (GaN) devices in an LLC resonant converter and quantitatively evaluated GaN devices' capabilities to improve converter efficiency.
Journal ArticleDOI

Evaluation of Gallium Nitride Transistors in High Frequency Resonant and Soft-Switching DC–DC Converters

TL;DR: In this paper, the authors evaluate the ability of gallium nitride transistors to improve efficiency and output power density in high frequency resonant and soft-switching applications, and experimentally verify the benefits of replacing Si MOSFETs with enhancement mode GaN transistors (eGaNFETs).
Proceedings ArticleDOI

Gate drive design considerations for high voltage cascode GaN HEMT

TL;DR: In this paper, the authors investigated gate drive design for high voltage gallium nitride (GaN) high electron-mobility transistors (HEMT) in a cascade structure.
References
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Journal ArticleDOI

AlGaN/GaN HEMTs-an overview of device operation and applications

TL;DR: This paper attempts to present the status of the technology and the market with a view of highlighting both the progress and the remaining problems of the AlGaN/GaN high-electron mobility transistor.
Proceedings ArticleDOI

Optimal design methodology for LLC resonant converter

TL;DR: In this paper, the relationship between converter efficiency and operation range with different circuit parameters has been revealed and an optimal design methodology has been developed based on the revealed relationship, and a 1MHz, 1kW LLC converter is designed to verify the proposed method.
Journal ArticleDOI

Analytical loss model of power MOSFET

TL;DR: In this article, an accurate analytical model is proposed to calculate the power loss of a metal-oxide semiconductor field effect transistor (FET) by considering the nonlinearity of the capacitors and the parasitic inductance in the circuit, such as the source inductor shared by the power stage and driver loop, the drain inductor, etc.
Journal ArticleDOI

GaN Power Transistors on Si Substrates for Switching Applications

TL;DR: In this article, GaN power transistors on Si substrates for power switching application are reported, and current collapse phenomena are discussed for GaN-HFETs on Si substrate, resulting in suppression of the current collapse due to using the conducting Si substrate.

GaN Power Transistors on Si Substrates for Switching Applications Hybrid MOS-FET transistor devices with low on-resistance, high hold-voltages and high breakdown voltage promise to provide high-power, low-loss operation for switching applications.

TL;DR: A hybrid metal-oxide-semiconductor HFET structure is a promising candidate for obtaining devices with a lower on-resistance and a high breakdown voltage as well as one of the cost-effective solutions.
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