Proceedings ArticleDOI
Litho variations and their impact on the electrical yield of a 32nm node 6T SRAM cell
Staf Verhaegen,Stefan Cosemans,Mircea Dusa,P. Marchal,Axel Nackaerts,Geert Vandenberghe,Wim Dehaene +6 more
TLDR
This paper evaluates the impact of litho variations on the yield of SRAM cells on the basis of different metrics for the stability, readability and write-ability used to define parametric yield.Abstract:
To ensure the continuation of the scaling of VLSI circuits fo r years to come, the impact of litho on performance of logic circuits has to be understood. Using different litho options such as single or double patterning may result in different process variations. This paper evaluates the impact of litho variations on the yield of SRAM cells. The exploration is focused on six transistor SRAM cells (6T SRAM) which have to be printed with the highest possible density with good yield to limit systems cost. Consequently, these cells im pose the most stringent constraints on litho techniques. An SRAM cell is yielding if it operates correctly like a memory device (functional yield) and the performance of the cell is in spec for the chosen architecture (parametric yield). In this paper, different metrics for the stability, readability and write-ability are used to define parametric yield. The most important litho-induced variations are illumination dose, focus, overlay mismatch and line-edge roughness. Unwanted opens and shorts in the printed patterns caused by the process variations will cause the cell to malfunction. These litho-induced variations also cause dimension offsets, i.e. variations on transistors widths and lengths, which reduces the stability, readability and write-ability of the cell, thereby increasing parametric yield loss. Litho simulators are coupled with a device parasitic extractor to simulate the impact of the litho offsets on the yield of the SRAM cell. Based on these simulations guidance will be provided on the choice between different litho options. Keywords: Yield, SRAM, line-width roughness, CD uniformity, overlayread more
Citations
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Proceedings ArticleDOI
32nm 1-D Regular Pitch SRAM Bitcell Design for Interference-Assisted Lithography
TL;DR: In this article, a 1-D regular pitch SRAM bitcell design for interference-assisted lithography (IAL) was proposed. But the layout design for IAL is not addressed.
Proceedings ArticleDOI
Interference Assisted Lithography for Patterning of 1D Gridded Design
Robert T. Greenway,Rudolf Hendel,Kwangok Jeong,Andrew B. Kahng,John S. Petersen,Zhilong Rao,Michael C. Smayling +6 more
TL;DR: It is shown that an IAL-friendly 6T SRAM bitcell can be designed following 1D gridded design rules and that the electrical characteristics is comparable to today's 2D design.
Patent
Shunt of p gate to n gate boundary resistance for metal gate technologies
TL;DR: In this article, a gate shunt is formed over a boundary between the metal gate structure of the NMOS transistor and the metal-gated PMOS transistor to provide a low-resistance connection between metal gate structures.
Proceedings ArticleDOI
Analysis and optimization of SRAM robustness for double patterning lithography
TL;DR: Using the proposed DPL-aware sizing scheme, the SRAM cell failure probability can be reduced by up to 3.6X, and cells optimized by the proposed approach have 7.9% lower dynamic energy as compared to non-DPL aware sizing optimization.
Proceedings ArticleDOI
Analyzing the impact of Double Patterning Lithography on SRAM variability in 45nm CMOS
TL;DR: Analysis of the impact of Double Patterning Lithography (DPL) on 6T SRAM variability demonstrates that DPL induced mismatch considerably increases functional failures in SRAM cells, and degrades yield.
References
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Journal ArticleDOI
Static-noise margin analysis of MOS SRAM cells
TL;DR: In this article, the stability of both resistor-load (R-load) and full-CMOS SRAM cells is investigated analytically as well as by simulation, and explicit analytic expressions for the static-noise margin (SNM) as a function of device parameters and supply voltage are derived.
Journal ArticleDOI
New Generation of Predictive Technology Model for Sub-45 nm Early Design Exploration
TL;DR: In this article, a new generation of predictive technology model (PTM) is developed to predict the characteristics of nanoscale CMOS, including process variations and correlations among model parameters.
Journal ArticleDOI
Intrinsic parameter fluctuations in decananometer MOSFETs introduced by gate line edge roughness
TL;DR: In this paper, the impact of the gate line edge roughness (LER) on the intrinsic parameters fluctuations in deep decananometer (sub 50 nm) gate MOSFETs was investigated.
Journal ArticleDOI
Read Stability and Write-Ability Analysis of SRAM Cells for Nanometer Technologies
TL;DR: This paper analyzes the read stability N-curve metrics and compares them with the commonly used static noise margin (SNM) metric defined by Seevinck, and demonstrates that the new metrics provide additional information in terms of current, which allows designing a more robust and stable cell.
Proceedings ArticleDOI
Reducing Variation in Advanced Logic Technologies: Approaches to Process and Design for Manufacturability of Nanoscale CMOS
TL;DR: In this article, the authors present an overview of process variation effects, including examples of mitigation strategies and test methods for 45 nm and 65 nm RDFs, including SRAM matching and interconnect variation.
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