There is, I think, something ethereal about i —the square root of minus one. I remember first hearing about it at school. It seemed an odd beast at that time—an intruder hovering on the edge of reality.

Usually familiarity dulls this sense of the bizarre, but in the case of i it was the reverse: over the years the sense of its surreal nature intensified. It seemed that it was impossible to write mathematics that described the real world in …

I and i

[신간의 별자리x] 우리/미술, 그리고 ‘슬픔의 박물관’

Introduction to Electromagnetic Compatibility

Antenna Theory And Design

Before the emergence of ultra-wideband (UWB) radios, widely used wireless communications were based on sinusoidal carriers, and impulse technologies were employed only in specific applications (e.g. radar). In 2002, the Federal Communication Commission (FCC) allowed unlicensed operation between 3.1–10.6 GHz for UWB communication, using a wideband signal format with a low EIRP level (−41.3dBm/MHz). UWB communication systems then emerged as an alternative to narrowband systems and significant effort in this area has been invested at the regulatory, commercial, and research levels.

IEEE Transactions on Microwave Theory and Techniques and Antennas and Propagation Announce a Joint Special Issue on Ultra-Wideband (UWB) Technology

Minimizing costs in printed circuit board layouts has led designers to use two signal layers between the reference planes, which introduce broadside coupling. Additionally, due to the fiber weave effect, designers route signal traces in a zig-zag fashion rather than in straight lines. This type of routing tends to be roughly periodic between the victim and the aggressor. The periodic-coupled routing creates periodic resonances in the near-end crosstalk and nulls in insertion loss (THRU) transfer functions as a consequence of Floquet modes. Due to the periodic resonances, the crosstalk is aggravated, which reduces the signal to crosstalk ratio. This study quantifies the effect of crosstalk due to periodic routing. In addition, design guidelines based on the angle of routing, length of period, and signaling speeds are formulated for designers using statistical bit error rate eye analysis.

Crosstalk Impact of Periodic-Coupled Routing on Eye Opening of High-Speed Links in PCBs

SMT decoupling capacitor location in DC power bus design is a critical design choice. Experimental evaluation of SMT decoupling design is presented in this work for a functioning high-speed PCB transmitting 1.0625 Gb/s serial data. SMT decoupling capacitors were removed in several steps while the swept-frequency |S/sub 21/| and power bus noise were monitored. It was found that the SMT decoupling capacitors located in proximity to the test ports decreased |S/sub 21/| and power bus noise at high frequencies, even far above their series resonant frequency. The hardware measurements demonstrate that local decoupling can be beneficial for high-frequency noise mitigation.

Evaluation of SMT decoupling design in a functioning high-speed PCB

The mobile industry processor interface (MIPI) standards defines industry specification for design of mobile devices such as smartphone, tables, laptop and hybrid devices. Such standard plays a critical role in the Internet of Things (IoT), 5G mobile devices, as well as autopilot automobiles. MIPI specification has comprehensive requirements on the data storage, data transfer, display, camera, memory, power, etc on the transmitter and receiver. In the testing phase, the transmitter and receiver may not be easily directly measured. Herein, a fast transmitter and receiver eye diagrams calculation methodology is necessary to predict the RX and TX performances of those devices. The calculated RX and TX eye diagrams are evaluated by using the D-PHY protocol to identify the quality of the signals. An in-house MIPI tool is built to directly display the calculated eye diagrams as well as the MIPI D-PHY report in the PC. The validations are performed by using both simulation and measurement examples.

Fast Transmitter and Receiver Eye Diagrams Acquisition in the MIPI D-PHY Interface

A method to extract a lumped element prototype SPICE model is used to study noise coupling between non-parallel traces on a PCB. The parameters in this model are extracted using a PEEC-like approach, a Circuit Extraction approach based on a Mixed-Potential Integral Equation formulation (CEMPIE). Without large numbers of unknowns, the SPICE model saves computation time. Also, it is easy to incorporate into system SPICE net list to acquire the system simulation result considering the coupling between traces on the printed circuit board (PCB). A representative case is studied, and the comparison of measurements, CEMPIE simulation, and SPICE modeling are given.

/pdf/extracting-cad-models-for-quantifying-noise-coupling-between-4gsoeym6co.pdf

Extracting CAD models for quantifying noise coupling between vias in PCB layouts

The high speed switching buck converter is widely used to reduce the cost and to improve the transient response. However, the switching voltage noise from high speed switching buck converter can be a potential problem such as conducted emission (CE) and radiated emission (RE) because of its high speed switching characteristics. The estimation of switching voltage noise from high speed switching buck converter is important to predict the impact on other device. In this paper, the modeling method of high speed switching buck converter based on the analysis of noise path is proposed so that the switching voltage from buck converter can be estimated and simulated more fast and simple without using SPICE model of buck converter IC. The proposed modeling method can replicate switching voltage in frequency domain and time domain.

Jun Fan

Papers

Crosstalk Impact of Periodic-Coupled Routing on Eye Opening of High-Speed Links in PCBs

Evaluation of SMT decoupling design in a functioning high-speed PCB

Fast Transmitter and Receiver Eye Diagrams Acquisition in the MIPI D-PHY Interface

Extracting CAD models for quantifying noise coupling between vias in PCB layouts

Modeling and Analysis of High Speed Switching Buck Converter IC for Conducted Emission Estimation