J
Jun Fan
Researcher at Missouri University of Science and Technology
Publications - 505
Citations - 7033
Jun Fan is an academic researcher from Missouri University of Science and Technology. The author has contributed to research in topics: Printed circuit board & Equivalent circuit. The author has an hindex of 36, co-authored 482 publications receiving 5641 citations. Previous affiliations of Jun Fan include Ulsan National Institute of Science and Technology & University of Missouri.
Papers
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Proceedings ArticleDOI
An equivalent three-dipole model for IC radiated emissions based on TEM cell measurements
TL;DR: In this paper, an equivalent dipole model is proposed to represent the source of radiated electromagnetic emissions from an integrated circuit (IC) and validated using the far-field measurements in a semi anechoic chamber for a test IC.
Journal ArticleDOI
Analytic Passive Intermodulation Behavior on the Coaxial Connector Using Monte Carlo Approximation
TL;DR: In this article, a smart contact model for a contact unit at a microcosmic level is proposed using Monte Carlo approximation and micromeasurements, different random distributed contact samples for different contact components inside the coaxial connector are reconstructed.
Journal ArticleDOI
Far-Field Prediction by Only Magnetic Near Fields on a Simplified Huygens's Surface
Jingnan Pan,Xu Gao,Jun Fan +2 more
TL;DR: In this paper, the magnetic near field is scanned on a Huygens's surface that encloses the source with its ground and the surface is further simplified by using four lines instead of four side walls to make the proposed method easier in regards to practical near-field scanning.
Journal ArticleDOI
Analytic Calculation of Jitter Induced by Power and Ground Noise Based on IBIS I/V Curve
TL;DR: The method is validated by comparing the analytic calculation results with HSPICE simulated results for a DDR4 output buffer, and the total time interval error induced by power and ground noise is obtained in both frequency domain and time domain.
Journal ArticleDOI
Inductance Calculations for Plane-Pair Area Fills With Vias in a Power Distribution Network Using a Cavity Model and Partial Inductances
TL;DR: In this paper, a hybrid method for the inductance calculation of via transitions between parallel planes is proposed, which correlates the definition of the partial inductance and a resonant cavity model.