J
Jun Fan
Researcher at Missouri University of Science and Technology
Publications - 505
Citations - 7033
Jun Fan is an academic researcher from Missouri University of Science and Technology. The author has contributed to research in topics: Printed circuit board & Equivalent circuit. The author has an hindex of 36, co-authored 482 publications receiving 5641 citations. Previous affiliations of Jun Fan include Ulsan National Institute of Science and Technology & University of Missouri.
Papers
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Journal ArticleDOI
An Efficient Method to Extract Surface-Wave Poles of Green's Functions Near Branch Cut in Lossy Layered Media
Siming Pan,Jun Fan +1 more
TL;DR: An efficient algorithm based on the contour method is proposed in this communication to locate these poles and calculate the residues and it is shown in numerical examples that some poles, very close to a branch cut, are successfully extracted in lossy media.
Journal ArticleDOI
Objective Total Isotropic Sensitivity Measurement
TL;DR: In this article, the authors proposed a new objective total isotropic sensitivity (TIS) measurement method, where the measured TIS is a function of the transmitter power level at its thermally stable condition.
Proceedings ArticleDOI
Decoupling Capacitor Placement Optimization With Lagrange Multiplier Method
Zhifei Xu,Jun Wang,Jun Fan +2 more
TL;DR: This paper proposes a decoupling capacitor placement optimization method based on the cavity model and Lagrange multiplier, and the results are compared to the brute-force method to prove the effectiveness of the proposed method.
Proceedings ArticleDOI
Conducted-Emission Modeling for a High-Speed ECL Clock Buffer
TL;DR: In this article, the authors derived total voltage sources and Thevenin equivalent circuits by measurements and simulations using IBIS models to characterize the conducted emissions from ICs, and applied the constructed noise source model for a test IC is applied in system-level simulations and the calculated far field radiation is validated with measurements.
Proceedings ArticleDOI
Limitations of First-Order Surface Impedance Boundary Condition and Its Effect on 2D Simulations for PCB Transmission Lines
TL;DR: It is found that the accuracy of the simulations with the first-order SIBC decreases as the edge of the signal conductor in the cross-section becomes narrower, and possible solutions are proposed to overcome the issue.