Jun Fan

TL;DR: In this paper, the authors describe a systematic approach to optimize and analyze the equivalent characteristic impedance of practical via structures using a genetic algorithm, and numerically characterize, by stochastic collocation method, the sensitivity of the equivalent impedance to the manufacturing uncertainties in the various geometrical parameters of a via structure.

TL;DR: In this article, the authors construct circuit models for the capacitors which include the local environment such that the overall PDN model is simplified and it can be considered as decoupled macromodels.

TL;DR: In this paper, the power distribution network in a printed circuit board (PCB) is modeled using the cavity model combined with segmentation method, and the vias are modeled using a via-plate capacitance model.

TL;DR: In this article, the authors examined the shielding characteristics of a class of computer systems each housed in similar cabinet racks that were not designed to provide significant levels of shielding at frequencies above a few hundred MHz, and concluded that these cabinet racks can provide shielding sufficient to be important in compliance with regulatory EMC requirements on radiated emissions.

TL;DR: In this paper, the authors investigated the root cause of far-end crosstalk (FEXT) level variance and proposed a design guideline for FEXT level control in high-volume PCB manufacturing.