J
Jun Fan
Researcher at Missouri University of Science and Technology
Publications - 505
Citations - 7033
Jun Fan is an academic researcher from Missouri University of Science and Technology. The author has contributed to research in topics: Printed circuit board & Equivalent circuit. The author has an hindex of 36, co-authored 482 publications receiving 5641 citations. Previous affiliations of Jun Fan include Ulsan National Institute of Science and Technology & University of Missouri.
Papers
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Proceedings ArticleDOI
Gassian Process Regression Analysis of Passive Intermodulation Level and DCR for Spring Contacts
Shengxuan Xia,Jiangshuai Li,Yang Xu,Ze Sun,Zhifei Xu,Yansheng Wang,Yuchu He,Nicholas McDonnell,Haicheng Zhou,Ken Wu,Jun Fan,Chulsoon Hwang +11 more
TL;DR: In this paper, the feasibility of estimating the nonlinearity level of spring contacts using DC resistance (DCR) has been investigated, which has easier access to be tested with much lower cost.
Proceedings ArticleDOI
Top-layer inductance extraction for the pre-layout power integrity using the physics-based model size reduction (PMSR) method
Ying S. Cao,Tamar Makharashvili,Samuel Connor,Bruce Archambeault,Li Jun Jiang,Albert E. Ruehli,Jun Fan,James L. Drewniak +7 more
TL;DR: In this article, a physics-based model size reduction (PMSR) method is applied to get the equivalent circuit model for the above-ground geometries, which can be used in analyzing the structure in its parts.
Proceedings ArticleDOI
Self-contact Introduced Passive Intermodulation Characterizations for Captured Springs
Jiangshuai Li,Shengxuan Xia,Zhifei Xu,Yang Xu,Yansheng Wang,Yuchu He,Ken Wu,Nicholas McDonnell,Warren Lee,Haicheng Zhou,Jun Fan,Chulsoon Hwang +11 more
TL;DR: In this article, the captured RF springs that can introduce noticeable passive intermodulation (PIM) due to their structural self-contact phenomenon are characterized and validated using an integrated camera.
Proceedings ArticleDOI
Study of cross polarization of tapered slot antenna for EMC measurements
TL;DR: In this paper, full-wave analysis of E-field distribution of various slotlines is presented, which reveals that the bilateral tapered slot antenna has the widest impedance bandwidth and the lowest cross-polarization level simultaneously.
Proceedings ArticleDOI
Impact of Voltage Bias on Through Silicon Vias (TSV) depletion and crosstalk
TL;DR: In this paper, the circuit segmentation approach for the modeling of Through Silicon Vias (TSV) is extended to the presence of time domain non linear phenomena such as depletion and capacitance hysteresis.