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Institution

3M

CompanySaint Paul, Minnesota, United States
About: 3M is a company organization based out in Saint Paul, Minnesota, United States. It is known for research contribution in the topics: Layer (electronics) & Coating. The organization has 7603 authors who have published 7907 publications receiving 254227 citations. The organization is also known as: Minnesota Mining and Manufacturing Company & 3M Company.


Papers
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Patent
Kenneth B. Wood1
24 Jul 1998
TL;DR: In this article, microperforated polymeric polymeric films and sound absorbers using such films are provided, which are relatively thin and flexible and may further include holes having a narrowest diameter less than the film thickness and a widest diameter greater than the smallest diameter.
Abstract: Microperforated polymeric films and sound absorbers using such films are provided. The microperforated polymeric films may be relatively thin and flexible and may further include holes having a narrowest diameter less than the film thickness and a widest diameter greater than the narrowest diameter. The microperforated polymeric films of a sound absorber may also have relatively large free span portions, which, in certain embodiments, may vibrate in response to incident sound waves.

80 citations

Patent
Ralph P. Fravel1, Ciril J. Godec1
25 Oct 1977
TL;DR: In this article, a urinary incontinence stimulator system using an intra-anal electrode which provides a recurring series of pulses of varying duration and frequency to the electrode with each series being spaced from the succeeding series by a rest period when no pulses are provided to the electrodes.
Abstract: A urinary incontinence stimulator system using an intra-anal electrode which provides a recurring series of pulses of varying duration and frequency to the electrode with each of such series of pulses spaced from the succeeding series by a rest period when no pulses are provided to the electrode.

80 citations

Patent
Curtis L. C1, Pierre H. C1
10 Aug 1987
TL;DR: In this paper, a package of food containing a substantial amount of water and solidified grease that can be cooked within the package in a microwave oven is presented, and a pad adjacent the food comprises microwave radiation transparent generally hydrophobic liquid grease absorbing materials that are capable of holding the amount of grease in the food when it is melted.
Abstract: A package of food containing a substantial amount of water and solidified grease that can be cooked within the package in a microwave oven. A pad adjacent the food comprises microwave radiation transparent generally hydrophobic liquid grease absorbing materials that are capable of holding the amount of grease in the food when it is melted; and a vapor tight microwave radiation transparent enclosure surrounding the pad and food includes means for venting steam from the enclosure as the food is cooked. Preferably, the pad is produced from microfibers constructed of a composition comprising a blend containing substantially equal parts by weight of polypropylene and poly 4-methylpentene-1.

80 citations

Patent
William L. Stoetzel1, Scott R. Culler1
30 Jan 1997
TL;DR: In this paper, a method of preparing an abrasive article, and the article produced therefrom is provided, which includes the steps of: providing a backing having a first major surface; coating the first major surfaces of the backing with a tie coat precursor, wherein the tie coat preconditioner comprises a first radiation curable component, and applying an abrasives slurry to the main surface after coating the precursor thereon, where the abrasive slurry comprises a plurality of abrasive particles and a binder precursor, and further wherein the binder component comprises a second radiation
Abstract: A method of preparing an abrasive article, and the article produced therefrom is provided. The method includes the steps of: providing a backing having a first major surface; coating the first major surface of the backing with a tie coat precursor, wherein the tie coat precursor comprises a first radiation curable component; applying an abrasive slurry to the first major surface of the backing after coating the tie coat precursor thereon, wherein the abrasive slurry comprises a plurality of abrasive particles and a binder precursor, and further wherein the binder precursor comprises a second radiation curable component; at least partially curing the tie coat precursor; and at least partially curing the binder precursor to form an abrasive article, wherein the abrasive article comprises a backing, an abrasive layer, and a tie coat disposed between the backing and the abrasive layer. Preferably, the method provides a structured abrasive article.

80 citations

Patent
Mark K. Debe1
05 Apr 1991
TL;DR: An electrically reactive composite article comprising a random or regular array of microstructures partially encapsulated within an encapsulating layer, each comprising a whiskerlike structure, optionally having a conformal coating enveloping the whisker-like structure is described in this paper.
Abstract: An electrically reactive composite article comprising a random or regular array of microstructures partially encapsulated within an encapsulating layer, microstructures each comprising a whisker-like structure, optionally having a conformal coating enveloping the whisker-like structure is described. The composite article is useful as an electrically conducting component of a circuit, antenna, microelectrode, reactive heater, and multimode sensor to detect the presence of vapors, gases, or liquid analystes.

80 citations


Authors

Showing all 7604 results

NameH-indexPapersCitations
P. Puppo10044869905
Constantinos Sioutas8740830871
Colin Norman7973422736
Peter W. Carr7751722507
John Collins7336825203
David L. Butler6614918703
Gerald J. Meyer6437316534
Jerome H. Lemelson6338319212
Frank R. Noyes629916220
Robert J. Linhardt58119053368
Roland Winston5547313911
Supratik Guha5424311611
Michael F. Weber5217310825
Carl Franzblau512067885
James S. Fritz482798639
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Performance
Metrics
No. of papers from the Institution in previous years
YearPapers
20231
20223
20071
20052
20044
20033