Chemistry and electrical properties of surfaces of GaN and GaN/AlGaN heterostructures
TLDR
In this article, the surface passivation process of GaN utilizing SiNx film by electron-cyclotron-resonance assisted plasma chemical vapor deposition (ECR-CVD) achieved low interface state density, 2×1011cm−2'eV−1.Abstract:
Chemical and electrical properties of the surfaces of GaN and GaN/AlGaN heterostructures were systematically investigated by x-ray photoelectron spectroscopy (XPS), capacitance–voltage, and current–voltage measurements. From in situ XPS study, relatively smaller band bending of 0.6 eV was seen at the GaN (2×2) surface grown by radio frequency-assisted molecular beam epitaxy on the metalorganic vapor phase epitaxy GaN template. After exposing the sample surface to air, strong band bending took place at the surface. The surface treatment in NH4OH solution and N2 plasma was found to reduce the surface Fermi level pinning. Surface passivation process of GaN utilizing SiNx film by electron-cyclotron-resonance assisted plasma chemical vapor deposition (ECR–CVD) achieved low interface state density, 2×1011cm−2 eV−1. No pronounced stress remained at the SiNx/GaN interface, which was confirmed by Raman spectroscopy. The present NH4OH/ECR–N2 plasma treatment was also found to be effective in realizing well-ordered ...read more
Citations
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Suppression of current collapse in insulated gate AlGaN/GaN heterostructure field-effect transistors using ultrathin Al2O3 dielectric
TL;DR: In this paper, the effects of electronic states at free surfaces of AlGaN/GaN heterostructure field effect transistors (HFETs) on the inner current transport at the heterointerfaces were investigated.
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Polarization effects in AlGaN/GaN and GaN/AlGaN/GaN heterostructures
TL;DR: In this paper, the influence of AlGaN and GaN cap layer thickness on Hall sheet carrier density and mobility was investigated for Al0.32Ga0.68N/GaN.
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Surface passivation of GaN and GaN/AlGaN heterostructures by dielectric films and its application to insulated-gate heterostructure transistors
TL;DR: In this article, the effects of plasma processing, formation of Si-based dielectrics, and formation of a thin Al2O3 film on the chemical and electronic properties of GaN and GaN/AlGaN heterostructure surfaces were systematically investigated.
Journal ArticleDOI
Effects of nitrogen deficiency on electronic properties of AlGaN surfaces subjected to thermal and plasma processes
TL;DR: In this paper, the effects of device processing on chemical and electronic properties of AlGaN surfaces were investigated, and the X-ray photoelectron spectroscopy analysis showed serious deterioration such as stoichiometry disorder and nitrogen deficiency (N deficiency) at the AlgaN surfaces processed by high-temperature annealing, H2-plasma cleaning, dry etching in CH4/H2/Ar plasma and deposition of SiO2.
Journal ArticleDOI
Testing the Temperature Limits of GaN-Based HEMT Devices
D. Maier,Mohammed Alomari,Nicolas Grandjean,Jean-François Carlin,M.-A. diForte-Poisson,Christian Dua,Andrey Chuvilin,David Troadec,Christophe Gaquiere,Ute Kaiser,Sylvain Delage,E. Kohn +11 more
TL;DR: In this paper, the high temperature stability of AlGaN/GaN and lattice-matched InAlN/GAN heterostructure FETs has been evaluated by a stepped temperature test routine under large-signal operation.
References
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Two-dimensional electron gases induced by spontaneous and piezoelectric polarization charges in N- and Ga-face AlGaN/GaN heterostructures
Oliver Ambacher,Joseph A. Smart,James R. Shealy,Nils Weimann,K. Chu,M. J. Murphy,William J. Schaff,L.F. Eastman,Roman Dimitrov,L. Wittmer,Martin Stutzmann,W. Rieger,J. Hilsenbeck +12 more
TL;DR: In this article, the authors investigated the role of spontaneous and piezoelectric polarization on the carrier confinement at GaN/AlGaN and AlGaN/GaN interfaces.
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The effect of surface passivation on the microwave characteristics of undoped AlGaN/GaN HEMTs
TL;DR: In this paper, the authors reported the highest reported microwave power density for undoped sapphire substrated AlGaN/GaN HEMT's on the same wafer.
Journal ArticleDOI
AlGaN/GaN metal oxide semiconductor heterostructure field effect transistor
TL;DR: In this paper, the authors report on the AlGaN/GaN metal oxide semiconductor heterostructure field effect transistor (MOS-HFET) and present the results of the comparative studies of this device and a base line AlGa n/Ga n heterostructured transistor (HFET), for a 5/spl mu/ source-to-drain opening, the maximum current was close to 600 mA/mm for both devices.
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AlGaN/GaN metal–oxide–semiconductor heterostructure field-effect transistors on SiC substrates
M. Asif Khan,Xiaobo Sharon Hu,A. Tarakji,Grigory Simin,J. W. Yang,Remigijus Gaska,Michael Shur +6 more
TL;DR: In this paper, an AlGaN/GaN metal-oxide-semiconductor heterostructure field effect transistors (MOS-HFETs) were developed for high power microwave and switching devices.
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Measurement of piezoelectrically induced charge in GaN/AlGaN heterostructure field-effect transistors
TL;DR: In this article, electron concentration profiles have been obtained for AlxGa1−xN/GaN heterostructure field effect transistor structures and the measured electron distributions demonstrate the influence of piezoelectric effects in coherently strained layers on III-V nitride heterostructures device characteristics.