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Effects of surface oxidation on the crystallization characteristics of Ge-rich Ge-Sb-Te alloys thin films

TLDR
In this article, the effect of surface oxidation on the crystallization of Ge-rich Ge-Sb-Te materials was studied, promising for Phase Change Memories working at high temperatures (>350°C).
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This article is published in Applied Surface Science.The article was published on 2020-07-15 and is currently open access. It has received 19 citations till now. The article focuses on the topics: Crystallization & Nucleation.

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Citations
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Endurance of Chalcogenide Optical Phase Change Materials: a Review

TL;DR: In this article , the authors discuss the various parameters that impact crystallization and re-amorphization of several Chalcogenide phase change materials, their failure mechanisms, and formulate design rules for enhancing cycling durability of these compounds.
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Effect of Nitrogen Doping on the Crystallization Kinetics of Ge2Sb2Te5.

TL;DR: In this article, a combination of in situ and ex situ transmission electron microscopy (TEM) investigations carried out on specifically designed samples to evidence the influence of N concentration on the crystallization kinetics and resulting morphology of the alloy.
Journal ArticleDOI

Crystallization and Electrical Properties of Ge-Rich GeSbTe Alloys

TL;DR: In this paper , the authors investigated Ge-rich Sb2Te3 and GeSbTe5 alloys with low or high amounts of Ge. The formation of the crystalline phases was followed as a function of annealing temperature by X-ray diffraction.
References
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Journal ArticleDOI

Phase-change materials for rewriteable data storage

TL;DR: This review looks at the unique property combination that characterizes phase-change materials, in particular the contrast between the amorphous and crystalline states, and the origin of the fast crystallization kinetics.
Journal ArticleDOI

Phase change memory technology

TL;DR: In this article, the authors survey the current state of phase change memory (PCM), a nonvolatile solid-state memory technology built around the large electrical contrast between the highly resistive amorphous and highly conductive crystalline states in so-called phase change materials.
Journal ArticleDOI

Breaking the Speed Limits of Phase-Change Memory

TL;DR: Ab initio molecular dynamics simulations reveal the phase-change kinetics in PCRAM devices and the structural origin of the incubation-assisted increase in crystallization speed, which paves the way for achieving a broadly applicable memory device, capable of nonvolatile operations beyond gigahertz data-transfer rates.
Journal ArticleDOI

Designing crystallization in phase-change materials for universal memory and neuro-inspired computing

TL;DR: This Review focuses on the crystallization mechanisms of PCMs as well as the design principles to achieve PCMs with high switching speeds and good data retention, which will aid the development of PCM-based universal memory and neuro-inspired devices.
Journal ArticleDOI

Phase-Change Technology and the Future of Main Memory

TL;DR: This article discusses how to mitigate limitations through buffer sizing, row caching, write reduction, and wear leveling, to make PCM a viable dream alternative for scalable main memories.
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Q1. What contributions have the authors mentioned in the paper "Effects of surface oxidation on the crystallization characteristics of ge-rich ge-sb-te alloys thin films" ?

The authors have studied the effect of surface oxidation on the crystallization of Ge-rich GeSb-Te materials, promising for Phase Change Memories working at high temperatures ( > 350°C ). For this, the authors have compared the structural and chemical characteristics of films left exposed to air with those shown by TiN-encapsulated films. Their results strongly suggest that “ seeds ” are formed in or below the oxide during the early stage of annealing, promoting the heterogeneous nucleation of the Ge cubic phase at a lower temperature than observed in encapsulated films. 

The most appealing characteristics of PCRAMs are their cyclability [13], their endurance and fast programming [14], while presenting an extremely easy scaling path [4]. 

As in encapsulated films, crystallization starts with the formation of Ge grains, which further grow by dragging the Ge excess out of the matrix until its concentration is low enough to allow the GST phase to nucleate. 

The temperature shift of 50-60°C which is observed, from 330°C for the air-exposed films to 380°C for the encapsulated films, does correspond to the temperature shift reported between heterogeneous and homogeneous crystallizations of amorphous Ge. 

To encapsulate the E-GST layer, an ultra-thin (~14 Å) Ti-rich layer was deposited on its surface prior to TiN deposition to favor its adhesion. 

In Ge2Sb2Te5 alloys, the selective consumption of Ge and Sb atoms due to oxidation and the stoichiometric imbalance which results not only promote the crystallization of the Te phase at low temperature but also to the partial crystallization of the GST alloy into the less rich Ge1Sb2Te4 phase [32, 40]. 

The film left exposed to air fully crystallizes after only 5 minutes, while the film that was encapsulated stays amorphous when annealed at this temperature. 

Ge accumulation also in the vicinity of the SiO2/E-GST bottom interface, tend to demonstrate that the seeds that promote this heterogeneous nucleation of the Ge cubic phase involve oxygen, directly as an impurity atom or complex, or most probably through a crystalline Sb2O3 phase. 

While not as clearly demonstrated, it is reasonable to think that, also in this case, the origin of the lowering of Tχ observed after air exposure relies on the elemental redistribution, resulting from selective oxidation, and on the formation of Te-rich regionswhich are able to crystallize at low temperature [32] and provide seeds for the subsequent heterogeneous crystallization of GST phases. 

This is why the complete crystallization of the films is accompanied by a massive transfer of Ge from the bulk towards the surface and a disruption of the initial stoichiometry of the film. 

most of the Te and Sb atoms initially present in the whole thickness of the film are now found accumulated in the last 50 nm, in the deepest part of the film, close to the bottom interface. 

the polycrystalline TiN layer deposited on the E-GST film is visible in the image of the encapsulated E-GST sample and detected in the associated diffraction pattern (Figure 1(b)). 

it is very probable that the 50-60°C shift of the crystallization temperature observed between the encapsulated and air-exposed films only reflects the change of nucleation mechanism of the Ge phase from homogeneous to heterogeneous nucleation.