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Electroluminescence Investigation of the Lateral Field Distribution in AlGaN/GaN HEMTs for Power Applications

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TLDR
In this article, the lifetime and stability of AlGaN/GaN heterostructure transistors at high power levels can be enhanced by introducing eld plates to reduce electric eld peaks in the gate drain region.
Abstract
The lifetime and stability of AlGaN/GaN heterostructure eld e ect transistors at high power levels can be enhanced by introducing eld plates to reduce electric eld peaks in the gate drain region. Simulations of the electric eld distribution along the channel using the 2D ATLAS software from Silvaco indicate that above a characteristic drain source voltage three spatially separated electric eld peaks appear, one located at the drain-side edge of the gate foot, one at the end of the drain-sided gate eld plate, and one at the end of the source shield eld plate. The close correlation between lateral electric eld and the electroluminescence due to hot electron related intra-band transitions can be very helpful when optimizing the electric eld distribution in high power devices. Electroluminescence microscopy images of devices with gate and source shield eld plate reveal the peaks located at the locations of enhanced electric eld. By studying the voltage dependence of the electroluminescence peaks the in uence of the eld plates on the electric eld distribution in source drain direction can be visualized.

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Citations
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Journal ArticleDOI

Mechanism of hot electron electroluminescence in GaN-based transistors

TL;DR: In this article, the authors investigated the nature of hot electron electroluminescence (EL) in AlGaN/GaN high electron mobility transistors and attributed it to Bremsstrahlung.
Journal ArticleDOI

Influence of surface states on the voltage robustness of AlGaN/GaN HFET power devices

TL;DR: The stress data, the simulation model and the images of EL indicate that the catastrophic failure arises in the dielectric underneath the gate field plate (GFP) of AlGaN/GaN field-effect transistors at high temperature reverse bias (HTRB) step stress.
Journal ArticleDOI

Substrate Bias Stress Induced Kink Effect in GaN-on-Silicon High-Electron-Mobility Transistor

TL;DR: In this paper , the authors investigated the kink effect in the output characteristics of the AlInN/GaN-on-Si high electron mobility transistor (HEMT) after subjecting the Si-substrate to positive/negative bias stress.
Journal ArticleDOI

Substrate Bias Stress Induced Kink Effect in GaN-on-Silicon High-Electron-Mobility Transistor

TL;DR: In this article, the authors investigated the kink effect in the output characteristics of the AlInN/GaN-on-Si high electron mobility transistor (HEMT) after subjecting the Si-substrate to positive/negative bias stress.
Proceedings ArticleDOI

With electroluminescence microcopy towards more reliable AlGaN/GaN transistors

TL;DR: In this article, the authors used electroluminescence microscopy (ELM) set-up to monitor submicron changes in the device geometry and hence to identify elevated electric field peaks being responsible for the acceleration of the degradation process.
References
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Journal ArticleDOI

Presence and origin of interface charges at atomic-layer deposited Al2O3/III-nitride heterojunctions

TL;DR: In this paper, the authors investigate scaling properties of gate-stacks consisting of Al2O3/III-Nitride heterojunctions and find interface charges that appear closely linked to the polarization charges of the underlying nitride substrate.
Journal ArticleDOI

Physical degradation of GaN HEMT devices under high drain bias reliability testing

TL;DR: TEM analysis revealed that electrically degraded devices always contain a pit-like defect next to the drain in the top AlGaN layer, and it has been found that the degree of the defect formation strongly correlates to drain current (IDmax) degradation.
Journal ArticleDOI

A model for the critical voltage for electrical degradation of GaN high electron mobility transistors

TL;DR: In this article, the authors formulated a first-order model for mechanical stress and elastic energy induced by the inverse piezoelectric effect in GaN HEMTs, which allows the computation of the critical voltage for degradation in these devices.
Proceedings ArticleDOI

Mechanisms responsible for dynamic ON-resistance in GaN high-voltage HEMTs

TL;DR: In this article, the dynamic ON-resistance of highvoltage GaN high-electron-mobility transistors (HEMTs) was investigated over a time span of 11 decades.
Journal ArticleDOI

Reduction in potential barrier height of AlGaN∕GaN heterostructures by SiN passivation

TL;DR: In this paper, SiN passivation on AlGaN∕GaN heterostructures was carried out using catalytic or plasma-enhanced chemical vapor deposition (Cat-CVD or PECVD), which has been found to increase two-dimensional electron gas (2DEG) density.
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