Journal ArticleDOI
Mini-Contact Enhanced Thermoelectric Cooling of Hot Spots in High Power Devices
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TLDR
In this paper, a chip package featuring a TE Mini-contact cooler integrated with conventional integrated heat spreader and heat sink is designed for hot-spot cooling, and the cooling performance of such chip package has been investigated by using a 3-D numeric model.Abstract:
Cooling hot-spots with high heat flux (e.g., >1000 W/cm2) is becoming one of the most important technical challenge in today's integrated circuit industry. More aggressive thermal solutions, than would be required for uniform heating, are highly desired. Recently, solid state thermoelectric coolers (TECs) have received more attention for hot-spot thermal management. However, present day TECs typically have cooling flux much lower than heat flux in the hot-spots. In this work, we reported an innovative technique-TE Mini-contact-to significantly increase cooling flux of TECs for the application in hot-spot cooling. A chip package featuring a TE Mini-contact cooler integrated with conventional integrated heat spreader and heat sink is designed. The cooling performance of such chip package has been investigated by using a 3-D numeric model. It is found that the cooling in the hot-spot (1250 W/cm2, 400 mum by 400 mum) can be about 19 degC better in the proposed package than that achieved in the conventional chip package without TEC. The effects of trench, die thickness, and TEC misalignment on the cooling of the hot-spot are also discussed.read more
Citations
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Journal ArticleDOI
Effect of local hot spots on flow boiling in a parallel strip fin heat sink
TL;DR: In this article, a parallel strip fin heat sink (PSFHS) and a mini-channel heat sink are comparatively tested using R141b as working fluid and nine separate spot-heaters are uniformly attached to the backside of the heat sinks to simulate the non-uniform heating condition.
Proceedings ArticleDOI
Integration of micro-contact enhanced thermoelectric cooler with a FEEDS manifold-microchannel system for cooling of high flux electronics
Sevket U. Yuruker,Daniel G. Bae,Raphael Mandel,Bao Yang,Patrick McCluskey,Avram Bar-Cohen,Michael M. Ohadi +6 more
TL;DR: In this paper, the integration of a microcontact enhanced TEC with a FEEDS manifold-micro channel system is presented, which can provide effective heat removal over the entire electronic chip surface.
Journal ArticleDOI
Corrections to "Mini-contact enhanced thermoelectric cooling of hot spots in high power devices"
Book ChapterDOI
Thermal Management of Flip Chip Packages
TL;DR: In this paper, the authors identified temperature as a causal factor in 55% of electronic failures in the US Air Force Avionics Integrity Program (AFIP) and found that in most commercial applications, electronic packages are not subjected to nearly as severe an environment in terms of vibration, dust or humidity as military avionics, so the percentage of failures caused by temperature are likely to occupy a larger piece of the pie.
Journal ArticleDOI
Spin analogs of thermo-magnetoelectric phenomena for heat switches
TL;DR: In this article, the spin Thomson coefficient is calculated for a yttrium-iron garnet plate and the corresponding estimates of the heat flux carried by the spins are also obtained, indicating at the possibility of further increase in the flux by an optimal choice of plate thickness and magnitude of magnetic field.
References
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Journal ArticleDOI
Thin-film thermoelectric devices with high room-temperature figures of merit
TL;DR: Th thin-film thermoelectric materials are reported that demonstrate a significant enhancement in ZT at 300 K, compared to state-of-the-art bulk Bi2Te3 alloys, and the combination of performance, power density and speed achieved in these materials will lead to diverse technological applications.
BookDOI
CRC Handbook of Thermoelectrics
TL;DR: In this article, Rowe et al. proposed a method for reducing the thermal conductivity of a thermoelectric generator by reducing the carrier concentration of the generator, which was shown to improve the generator's performance.
Journal ArticleDOI
Quantum dot superlattice thermoelectric materials and devices.
TL;DR: It is demonstrated that improved cooling values relative to the conventional bulk (Bi,Sb)2(Se,Te)3thermoelectric materials using a n-type film in a one-leg thermoelectrics device test setup, which cooled the cold junction 43.7 K below the room temperature hot junction temperature of 299.8 K.
Journal ArticleDOI
Simultaneous measurements of Seebeck coefficient and thermal conductivity across superlattice
TL;DR: In this article, an Au/Cr pattern serves as both a heater and a thermometer, and a microprobe is prepared between the heater and the thin film to extract the Seebeck voltage.
Journal ArticleDOI
On-chip solid-state cooling for integrated circuits using thin-film microrefrigerators
Ali Shakouri,Yan Zhang +1 more
TL;DR: An overview of recent advances in solid-state cooling utilizing thin-film silicon germanium-based microrefrigerators is given in this article, where key parameters affecting micro cooler performance are described.