Journal ArticleDOI
Mini-Contact Enhanced Thermoelectric Cooling of Hot Spots in High Power Devices
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TLDR
In this paper, a chip package featuring a TE Mini-contact cooler integrated with conventional integrated heat spreader and heat sink is designed for hot-spot cooling, and the cooling performance of such chip package has been investigated by using a 3-D numeric model.Abstract:
Cooling hot-spots with high heat flux (e.g., >1000 W/cm2) is becoming one of the most important technical challenge in today's integrated circuit industry. More aggressive thermal solutions, than would be required for uniform heating, are highly desired. Recently, solid state thermoelectric coolers (TECs) have received more attention for hot-spot thermal management. However, present day TECs typically have cooling flux much lower than heat flux in the hot-spots. In this work, we reported an innovative technique-TE Mini-contact-to significantly increase cooling flux of TECs for the application in hot-spot cooling. A chip package featuring a TE Mini-contact cooler integrated with conventional integrated heat spreader and heat sink is designed. The cooling performance of such chip package has been investigated by using a 3-D numeric model. It is found that the cooling in the hot-spot (1250 W/cm2, 400 mum by 400 mum) can be about 19 degC better in the proposed package than that achieved in the conventional chip package without TEC. The effects of trench, die thickness, and TEC misalignment on the cooling of the hot-spot are also discussed.read more
Citations
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Journal ArticleDOI
Transient Cooling and Heating Effects in Holey Silicon-Based Lateral Thermoelectric Devices for Hot Spot Thermal Management
TL;DR: In this paper, the role of anisotropy in transient cooling and heating effects is studied for lateral thermoelectric devices with anisotropic thermal conductivities, where the Peltier cooling and the Joule heating occur in a lateral direction.
Dissertation
Graphene Heat Spreaders for Electronics Thermal Management Applications
TL;DR: In this paper, thermal chemical vapor deposition (TCVD), liquid phase exfoliation (LPE) from graphite, and reduction of graphene ox- ide (GO) were used to synthesize graphene, and transfer methods were also demonstrated.
Journal ArticleDOI
Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies
TL;DR: In this paper, the effects of various parameters involved in the chip design and cooling on the occurrence of hot spots on a multicore processor chip were investigated, and the results indicated that a major part of the temperature contrast is formed at a granularity corresponding to the size of functional units on actual microprocessor chips.
Journal ArticleDOI
CFD investigation of the feasibility of polymer-based microchannel heat sink as thermal solution
Yue Seong Ong,KuZilati KuShaari +1 more
TL;DR: In this article, the feasibility of polymer-based microchannel heat sinks (MCHSs) as thermal solutions was evaluated using three-dimensional CFD approach and the effect of thermal conductivity of fabrication materials, including polymerbased PDMS, PTFE, PDMS/MWCNT, and metal-based aluminum, was investigated and compared at various inlet flow rate, fluid thermal conductivities, and microchannel ratio at different constant heat fluxes.
Journal ArticleDOI
Materials and Devices for On-Chip and Off-Chip Peltier Cooling: A Review
TL;DR: The thermoelectric effect forms the basis of Peltier cooling that has attracted interest for solid-state refrigeration for more than a century as discussed by the authors. But the dearth of materials level efficiency in converting between heat and electricity has limited widespread applications.
References
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Journal ArticleDOI
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TL;DR: An overview of recent advances in solid-state cooling utilizing thin-film silicon germanium-based microrefrigerators is given in this article, where key parameters affecting micro cooler performance are described.