Journal ArticleDOI
Mini-Contact Enhanced Thermoelectric Cooling of Hot Spots in High Power Devices
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TLDR
In this paper, a chip package featuring a TE Mini-contact cooler integrated with conventional integrated heat spreader and heat sink is designed for hot-spot cooling, and the cooling performance of such chip package has been investigated by using a 3-D numeric model.Abstract:
Cooling hot-spots with high heat flux (e.g., >1000 W/cm2) is becoming one of the most important technical challenge in today's integrated circuit industry. More aggressive thermal solutions, than would be required for uniform heating, are highly desired. Recently, solid state thermoelectric coolers (TECs) have received more attention for hot-spot thermal management. However, present day TECs typically have cooling flux much lower than heat flux in the hot-spots. In this work, we reported an innovative technique-TE Mini-contact-to significantly increase cooling flux of TECs for the application in hot-spot cooling. A chip package featuring a TE Mini-contact cooler integrated with conventional integrated heat spreader and heat sink is designed. The cooling performance of such chip package has been investigated by using a 3-D numeric model. It is found that the cooling in the hot-spot (1250 W/cm2, 400 mum by 400 mum) can be about 19 degC better in the proposed package than that achieved in the conventional chip package without TEC. The effects of trench, die thickness, and TEC misalignment on the cooling of the hot-spot are also discussed.read more
Citations
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Journal ArticleDOI
A comprehensive review of thermoelectric technology: materials, applications, modelling and performance improvement
TL;DR: In this article, a comprehensive review of thermoelectric (TE) technology encompassing the materials, applications, modelling techniques and performance improvement is carried out, including output power conditioning techniques.
Journal ArticleDOI
Flow boiling in microchannels: Fundamentals and applications
TL;DR: In this paper, a discussion of the possible applications of flow boiling in microchannels in order to highlight the challenges in the thermal management for each application is presented. But, several fundamental issues are still not understood and this hinders the transition from laboratory research to commercial applications.
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Electronic and Thermal Properties of Graphene and Recent Advances in Graphene Based Electronics Applications
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Journal ArticleDOI
Superlattice-based thin-film thermoelectric modules with high cooling fluxes
Gary E. Bulman,Phil Barletta,Jay Lewis,Nicholas Baldasaro,Michael Manno,Avram Bar-Cohen,Bao Yang +6 more
TL;DR: It is shown that cooling fluxes of 258 W cm−2 can be achieved in thin-film Bi2Te3-based superlattice thermoelectric modules, which will have far-reaching impacts in diverse applications, such as advanced computer processors, radio-frequency power devices, quantum cascade lasers and DNA micro-arrays.
Journal ArticleDOI
Thermal Management of On-Chip Hot Spot
Avram Bar-Cohen,Peng Wang +1 more
TL;DR: The physical phenomena underpinning the most promising on-chip thermal management approaches for hot spot remediation, along with basic modeling equations and typical results are described in this paper, where attention is devoted to thermoelectric microcoolers.
References
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Journal ArticleDOI
An Assessment of Module Cooling Enhancement With Thermoelectric Coolers
TL;DR: In this paper, the authors provide an assessment of the potential for module cooling enhancement with thermoelectric coolers and compare the allowable module power and chip temperature with and without thermal coolers based upon either air or water module level cooling.
Proceedings ArticleDOI
Thermoelectric microcoolers for thermal management applications
J.-P. Fleurial,Alexander Borshchevsky,Margaret A. K. Ryan,W. Phillips,E. Kolawa,T. Kacisch,R. Ewell +6 more
TL;DR: In this paper, a thermoelectric microcooler is proposed to operate at temperatures at or even below the ambient temperature of the heat sink, resulting in increased reliability and efficiency.
Proceedings ArticleDOI
Thermoelectric Micro-Cooler for Hot-Spot Thermal Management
TL;DR: In this article, a three-dimensional electro-thermal finite-element modeling study of a thermoelectric micro-cooler is presented, which focuses on the hot-spot temperature reductions associated with variations in microcooler geometry, chip thickness and chip doping concentration, along with the parasitic Joule heating effects from the electrical contact resistance and current flow through the silicon.
Patent
Thermal management of systems having localized regions of elevated heat flux
Bao Yang,Avram Bar-Cohen +1 more
TL;DR: In this article, a thermal management system includes a first heat transfer body ( 330 ) for providing a opposing heat flux to at least one localized region of elevated heat flux residing in adjacency to a region of lesser flux, such as on a surface ( 315 a ) of a circuit die ( 315 ) due to a integrated circuit hot-spot ( 310 ).
Proceedings ArticleDOI
Thermoelectric mini-contact cooler for hot-spot removal in high power devices
TL;DR: In this article, a chip package featuring a TE mini-contact cooler integrated with conventional integrated heat spreader (IHS) and heat sink is designed, and the cooling performance of such chip package is investigated by using a 3D numeric model.