Journal ArticleDOI
Mini-Contact Enhanced Thermoelectric Cooling of Hot Spots in High Power Devices
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TLDR
In this paper, a chip package featuring a TE Mini-contact cooler integrated with conventional integrated heat spreader and heat sink is designed for hot-spot cooling, and the cooling performance of such chip package has been investigated by using a 3-D numeric model.Abstract:
Cooling hot-spots with high heat flux (e.g., >1000 W/cm2) is becoming one of the most important technical challenge in today's integrated circuit industry. More aggressive thermal solutions, than would be required for uniform heating, are highly desired. Recently, solid state thermoelectric coolers (TECs) have received more attention for hot-spot thermal management. However, present day TECs typically have cooling flux much lower than heat flux in the hot-spots. In this work, we reported an innovative technique-TE Mini-contact-to significantly increase cooling flux of TECs for the application in hot-spot cooling. A chip package featuring a TE Mini-contact cooler integrated with conventional integrated heat spreader and heat sink is designed. The cooling performance of such chip package has been investigated by using a 3-D numeric model. It is found that the cooling in the hot-spot (1250 W/cm2, 400 mum by 400 mum) can be about 19 degC better in the proposed package than that achieved in the conventional chip package without TEC. The effects of trench, die thickness, and TEC misalignment on the cooling of the hot-spot are also discussed.read more
Citations
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Journal ArticleDOI
Functionalization mediates heat transport in graphene nanoflakes
Haoxue Han,Yong Zhang,Nan Wang,Majid Kabiri Samani,Yuxiang Ni,Zainelabideen Y. Mijbil,Michael Edwards,Shiyun Xiong,Kimmo Sääskilahti,Murali Murugesan,Yifeng Fu,Lilei Ye,Hatef Sadeghi,Steven Bailey,Yuriy A. Kosevich,Yuriy A. Kosevich,Colin J. Lambert,Johan Liu,Johan Liu,Sebastian Volz +19 more
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Journal ArticleDOI
Hotspot cooling with jumping-drop vapor chambers
Kris F. Wiedenheft,H. Alex Guo,Xiaopeng Qu,Jonathan B. Boreyko,Fangjie Liu,Kungang Zhang,Feras Eid,Arnab Choudhury,Zhihua Li,Chuan-Hua Chen +9 more
TL;DR: In this paper, a jumping-drop vapor chamber consisting of parallel plates of a superhydrophilic evaporator and a super-hydrophobic condenser is proposed to address mobile hotspots with a pathway toward effective thermal transport in the out-ofplane direction.
Journal ArticleDOI
On-chip Hot Spot Remediation with Miniaturized Thermoelectric Coolers
Avram Bar-Cohen,Peng Wang +1 more
TL;DR: In this paper, the authors present a comprehensive review of recent advances in novel applications of superlattice, mini-contact, and silicon-based miniaturized thermoelectric coolers in reducing the severity of on-chip hot spots.
Journal ArticleDOI
Efficient on-chip hotspot removal combined solution of thermoelectric cooler and mini-channel heat sink
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Proceedings ArticleDOI
Near-Junction Thermal Management for Wide Bandgap Devices
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