scispace - formally typeset
M

Massoud Pedram

Researcher at University of Southern California

Publications -  812
Citations -  25236

Massoud Pedram is an academic researcher from University of Southern California. The author has contributed to research in topics: Energy consumption & CMOS. The author has an hindex of 77, co-authored 780 publications receiving 23047 citations. Previous affiliations of Massoud Pedram include University of California, Berkeley & Syracuse University.

Papers
More filters
Journal ArticleDOI

An Ultra Low-Power Memristive Neuromorphic Circuit for Internet of Things Smart Sensors

TL;DR: The results of the study reveal that the designed neuromorphic circuits, along with the proposed A/D and D/A converters, provide an average power saving of over the ASIC implementation in a 90-nm CMOS technology.
Proceedings ArticleDOI

Concurrent optimization of consumer's electrical energy bill and producer's power generation cost under a dynamic pricing model

TL;DR: Three models are presented for consumers, utility companies, and a third-part arbiter to optimize the cost to the parties individually and in combination and show results that show that the energy consumption distribution becomes very stable during the day utilizing the models.
Proceedings ArticleDOI

Stochastic sequential machine synthesis targeting constrained sequence generation

TL;DR: Based on Moore-type machines, a general procedure for SSM synthesis is revealed and a new framework for sequence characterization is built to match designer's needs for sequence generation or compaction.
Journal ArticleDOI

Res-DNN: A Residue Number System-Based DNN Accelerator Unit

TL;DR: This article proposes a technique, based on using Residue Number System (RNS), to improve the energy efficiency of Deep Neural Networks (DNNs) and suggests a Huffman-based coding for accessing the weights stored in the main memory.
Proceedings ArticleDOI

Analysis of substrate thermal gradient effects on optimal buffer insertion

TL;DR: Experimental results show that neglecting thermal gradients in the substrate and the interconnect lines can result in non-optimal solutions when using standard buffer insertion techniques and that these effects intensify with technology scaling.