Actel

About: Actel is a based out in . It is known for research contribution in the topics: Antifuse & Field-programmable gate array. The organization has 364 authors who have published 402 publications receiving 12674 citations.

An electro-thermal model for metal-oxide-metal antifuses

Abstract: In this paper, a complete electro-thermal analysis is presented for the metal-oxide-metal antifuses. The application of the Wiedemann-Franz Law and the thin film effect on thermal and electrical conductivities of metal films were also discussed. Several key parameters for tungsten-oxide-tungsten antifuse were extracted. The reaction temperature between tungsten and oxide was estimated to be around 1300/spl deg/C. The core resistivity was found to be around 250 /spl mu//spl Omega//spl middot/cm. This model can be readily extended to the other metal-dielectric-metal systems. >

Read-disturb tolerant metal-to-metal antifuse and fabrication method

Abstract: A "read-disturb" resistant metal-to-metal antifuse includes a lower electrode comprising a first metal layer in a microcircuit structure. An inter-metal dielectric is disposed over the lower electrode and includes an antifuse aperture disposed therein. A first layer of antifuse material is disposed over exposed surface of the lower electrode in the antifuse aperture. A highly conductive layer is disposed over the first region of antifuse material and a second layer of antifuse material is disposed over the highly conductive layer. An upper electrode comprises a second metal layer disposed over the second layer of antifuse material. The first and second layers of antifuse material may comprise single-layer or multi-layer dielectric materials, amorphous silicon, or combinations of these materials. A process for fabricating a read-disturb resistant metal-to-metal antifuse comprises the steps of forming a lower electrode comprising a portion of a first metal layer in a microcircuit structure; forming an inter-metal dielectric layer over the lower electrode; forming an antifuse aperture in the inter-metal dielectric layer to expose the upper surface of the lower electrode; forming a first layer of antifuse material over the exposed surface of the lower electrode in the antifuse aperture; forming a highly conductive layer over the first layer of antifuse material; forming a second layer of antifuse material over the highly conductive layer; and forming an upper electrode comprising a second metal layer over the second layer of antifuse material.

An Analysis of Single Event Upset Dependencies on High Frequency and Architectural Implementations within Actel RTAX-S Family Field Programmable Gate Arrays

Abstract: In order to investigate frequency and architectural effects on Single Event Upset cross sections within RTAX-S FPGA devices, a novel approach to high speed testing is implemented. Testing was performed at variable speeds ranging from 15 MHz to 150 MHz

Improving Simulated Annealing-Based FPGA Placement With Directed Moves

Abstract: Simulated annealing remains a widely used heuristic for field-programmable gate array placement due, in part, to its ability to produce high-quality placements while accommodating complex objective functions. This paper discusses enhancements to annealing-based placement which improve upon both quality and run-time. Specifically, intelligent strategies for selecting and placing cells are interspersed with traditional random moves during an anneal, allowing the annealer to converge more quickly and to attain better quality with less statistical variability. For the same amount of computational effort, the contributions discussed in this paper consistently improve both critical path delay and wire length compared to traditional annealing perturbations.

Raised tungsten plug antifuse and fabrication processes

Abstract: An antifuse comprises a lower electrode formed from a metal layer in a microcircuit. A interlayer dielectric layer is disposed over the lower electrode and has an aperture formed therein. A conductive plug, formed from a material such as tungsten, is formed in the aperture. The upper surface of the interlayer dielectric is etched back to create a raised portion of the plug. The upper edges of the plug are rounded. An antifuse layer, preferably comprising a silicon nitride, amorphous silicon, silicon nitride sandwich incorporating a thin silicon dioxide layer above or below the amorphous silicon layer or such a sandwich structure covered by a titanium nitride layer, is disposed above the plug. An upper electrode, preferably comprising a metal layer is disposed over the antifuse layer.