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A comprehensive model of PMOS NBTI degradation

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TLDR
A comprehensive model for NBTI phenomena within the framework of the standard reaction–diffusion model is constructed and it is demonstrated how to solve the reaction-diffusion equations in a way that emphasizes the physical aspects of the degradation process and allows easy generalization of the existing work.
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This article is published in Microelectronics Reliability.The article was published on 2005-01-01 and is currently open access. It has received 710 citations till now. The article focuses on the topics: Negative-bias temperature instability.

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Degradation characteristics of metal/Al2O3/n-InGaAs capacitors

TL;DR: In this paper, the degradation under constant voltage stress of metal gate/Al2O3/InGaAs stacks is studied for different pre-dielectric deposition treatments, and the degradation, particularly under negative bias, is strongly affected by the oxide-semiconductor surface treatment of the samples.
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Time-dependent variability of high-k based MOS devices: Nanoscale characterization and inclusion in circuit simulators

TL;DR: In this paper, the authors focused on the time-dependent shifts coming from the gate dielectric in MOS devices and compared different approaches to characterize (at the nanoscale), model (at device level) and simulate (in a circuit) the related phenomena.
Proceedings ArticleDOI

TCAD Modeling of Negative Bias Temperature Instability

TL;DR: In this article, a coupling of the reaction-diffusion (RD) model to the semiconductor equations is presented to study degradation during realistic device operating conditions, and the model is extended to improve the prediction both in the stress and the relaxation phase by accounting for trap controlled transport of the released hydrogen species.
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WearMon: Reliability monitoring using adaptive critical path testing

TL;DR: WearMon is presented, an adaptive critical path monitoring architecture which provides accurate and real-time measure of the processor's timing margin degradation and can be easily integrated into existing designs.
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Intrinsic Reliability Improvement in Biaxially Strained SiGe p-MOSFETs

TL;DR: In this paper, a biaxially strained SiGe (20% Ge) channel on Si p-type metal-oxide semiconductor field effect transistors was proposed to improve hole mobility and reliability.
References
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Journal ArticleDOI

Anomalous transit-time dispersion in amorphous solids

TL;DR: In this paper, the authors developed a stochastic transport model for the transient photocurrent, which describes the dynamics of a carrier packet executing a time-dependent random walk in the presence of a field-dependent spatial bias and an absorbing barrier at the sample surface.
Book

The physics of amorphous solids

TL;DR: The formation of amorphous solids Amorphous Morphology: The Geometry and Topology of Disorder Chalcogenide Glasses and Organic Polymers The Percolation Model Localization Delocalization Transitions Optical and Electrical Properties Index as discussed by the authors.
Journal ArticleDOI

Negative bias temperature instability: Road to cross in deep submicron silicon semiconductor manufacturing

TL;DR: The negative bias temperature instability (NBTI) commonly observed in p-channel metaloxide-semiconductor field effect transistors when stressed with negative gate voltages at elevated temperatures is discussed in this article.
Journal ArticleDOI

Negative bias stress of MOS devices at high electric fields and degradation of MNOS devices

TL;DR: A detailed study of the increase of the number of surface traps in MOS structures after NBS at temperatures (25-125°C) and fields (400-700 MV/m) comparable to those used in MNOS devices is presented in this article.
Journal ArticleDOI

Characteristics of the Surface‐State Charge (Qss) of Thermally Oxidized Silicon

TL;DR: In this paper, the surface state charge associated with thermally oxidized silicon has been studied experimentally using MOS structures and the results indicate that the surface-state charge can be reproducibly controlled over a range 1010-1012 cm -2, and it is an intrinsic property of the silicon dioxide-silicon system.
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Frequently Asked Questions (2)
Q1. What contributions have the authors mentioned in the paper "A comprehensive model of pmos nbti degradation" ?

In this paper, the authors construct a comprehensive model for NBTI phenomena within the framework of the standard reaction–diffusion model. The authors demonstrate how to solve the reaction–diffusion equations in a way that emphasizes the physical aspects of the degradation process and allows easy generalization of the existing work. The authors also augment this basic reaction–diffusion model by including the temperature and field-dependence of the NBTI phenomena so that reliability projections can be made under arbitrary circuit operating conditions. 

One of the key goal of their future work would be to clarify the role of such processing changes on NBTI performance.