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A comprehensive model of PMOS NBTI degradation

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TLDR
A comprehensive model for NBTI phenomena within the framework of the standard reaction–diffusion model is constructed and it is demonstrated how to solve the reaction-diffusion equations in a way that emphasizes the physical aspects of the degradation process and allows easy generalization of the existing work.
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This article is published in Microelectronics Reliability.The article was published on 2005-01-01 and is currently open access. It has received 710 citations till now. The article focuses on the topics: Negative-bias temperature instability.

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Journal ArticleDOI

Evidence of negative bias temperature instability in 4H-SiC metal oxide semiconductor capacitors

TL;DR: In this paper, the authors characterized the lifetime and interface state densities of n-type 4H-SiC metal oxide semiconductor capacitors using the pulsed MOS capacitor technique.
Proceedings ArticleDOI

BTI impact on logical gates in nano-scale CMOS technology

TL;DR: A simulation-based BTI analysis in both basic (such as NAND and NOR) and complex gates while considering the impact of input's duty cycle, the frequency at which they change, as well as theimpact of the stressed transistor location shows that the impact is strongly gate dependent and that in general the impact in complex gates is larger.
Journal ArticleDOI

A comprehensive modeling framework for gate stack process dependence of DC and AC NBTI in SiON and HKMG p-MOSFETs

TL;DR: The model can successfully predict long time DC and AC stress data and has been used to determine device degradation at end of life as EOT is scaled for different HKMG devices.
Journal ArticleDOI

On the temperature dependence of NBTI recovery

TL;DR: The understanding of the recovery physics can be probed in an unprecedented manner by using this technique, which is able to perform NBTI at a certain stress temperature, which generates a certain degradation level, while the recovery itself can be studied at arbitrary temperatures.
Proceedings ArticleDOI

Reliability- and Process-variation aware design of integrated circuits — A broader perspective

TL;DR: A broad review of the literature for reliability and process-variation aware VLSI design shows a re-emergence of the topic as a core area of active research as mentioned in this paper.
References
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Journal ArticleDOI

Anomalous transit-time dispersion in amorphous solids

TL;DR: In this paper, the authors developed a stochastic transport model for the transient photocurrent, which describes the dynamics of a carrier packet executing a time-dependent random walk in the presence of a field-dependent spatial bias and an absorbing barrier at the sample surface.
Book

The physics of amorphous solids

TL;DR: The formation of amorphous solids Amorphous Morphology: The Geometry and Topology of Disorder Chalcogenide Glasses and Organic Polymers The Percolation Model Localization Delocalization Transitions Optical and Electrical Properties Index as discussed by the authors.
Journal ArticleDOI

Negative bias temperature instability: Road to cross in deep submicron silicon semiconductor manufacturing

TL;DR: The negative bias temperature instability (NBTI) commonly observed in p-channel metaloxide-semiconductor field effect transistors when stressed with negative gate voltages at elevated temperatures is discussed in this article.
Journal ArticleDOI

Negative bias stress of MOS devices at high electric fields and degradation of MNOS devices

TL;DR: A detailed study of the increase of the number of surface traps in MOS structures after NBS at temperatures (25-125°C) and fields (400-700 MV/m) comparable to those used in MNOS devices is presented in this article.
Journal ArticleDOI

Characteristics of the Surface‐State Charge (Qss) of Thermally Oxidized Silicon

TL;DR: In this paper, the surface state charge associated with thermally oxidized silicon has been studied experimentally using MOS structures and the results indicate that the surface-state charge can be reproducibly controlled over a range 1010-1012 cm -2, and it is an intrinsic property of the silicon dioxide-silicon system.
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Frequently Asked Questions (2)
Q1. What contributions have the authors mentioned in the paper "A comprehensive model of pmos nbti degradation" ?

In this paper, the authors construct a comprehensive model for NBTI phenomena within the framework of the standard reaction–diffusion model. The authors demonstrate how to solve the reaction–diffusion equations in a way that emphasizes the physical aspects of the degradation process and allows easy generalization of the existing work. The authors also augment this basic reaction–diffusion model by including the temperature and field-dependence of the NBTI phenomena so that reliability projections can be made under arbitrary circuit operating conditions. 

One of the key goal of their future work would be to clarify the role of such processing changes on NBTI performance.