scispace - formally typeset
Journal ArticleDOI

Experimental Evaluation of Self-Heating and Analog/RF FOM in GAA-Nanowire FETs

Reads0
Chats0
TLDR
The characterization and modeling of multi-finger gate all around (GAA) nanowire (NW) FETs (NWFETs) from dc to 14 GHz shows a good correlation with the measurement data and the self-heating effect (SHE) is significant in short-channel silicon on insulator (SOI) NWFets.
Abstract
In this paper, we report the characterization and modeling of multi-finger gate all around (GAA) nanowire (NW) FETs (NWFETs) from dc to 14 GHz. The self-heating effect (SHE) in NWFETs is investigated experimentally using the small-signal output conductance ( ${g}_{{\text {ds}}}$ ) technique. The frequency-dependent complex thermal impedance, ${Z}_{{\text {th}}}({f})$ , is extracted by fitting an ${n}$ th-order thermal network with the experimental data. We show that the temperature rise $\Delta {T}$ (=85 °C) due to SHE is significant in short-channel silicon on insulator (SOI) NWFETs. Finally, we have evaluated the RF figure of merit (FOM) for these NWFETs as ${f}_{T}$ (=70 GHz) and ${f}_{\text {max}}$ (=80 GHz). We also report the RF performance metric sensitivity on temperature, $\partial {f}_{\text {max}}/\partial {T}_{{\text {amb}}}$ ( $\approx -0.104$ GHz/K). The reported BSIM-CMG compact model shows a good correlation with the measurement data.

read more

Citations
More filters
Journal ArticleDOI

Self-Heating in FDSOI UTBB MOSFETs at Cryogenic Temperatures and its Effect on Analog Figures of Merit

TL;DR: In this article, the authors investigated the effect of self-heating on analog figures of merit (FoMs) at different temperature levels and found that analog FoMs are slightly weaker at cryogenic temperatures with respect to room temperature case.
Journal ArticleDOI

A Simulation Study of Gate-All-Around Nanowire Transistor With a Core-Substrate

TL;DR: A novel Core-Substrate Gate-All-Around (CSGAA) nanowire structure has been proposed, investigated and simulated systematically based on 3D numerical simulation, making it a promising candidate of future high performance and low power CMOS devices.
Journal ArticleDOI

On the Separate Extraction of Self-Heating and Substrate Effects in FD-SOI MOSFET

TL;DR: In this article, an approach to separately characterize self-heating and substrate effects in FD-SOI MOSFETs has been proposed, which is based on the extraction of the back-gate and substrate networks from the S-parameters measured at the zero-temperature coefficient bias.
Journal ArticleDOI

Impact of Gamma-Ray Radiation on DC and RF Performance of 10-nm Bulk N-Channel FinFETs

TL;DR: An empirical model is developed to predict the degradation in the radiation tolerance of 10-nm bulk n-channel FinFETs with changing device geometries and gamma-ray radiation dose.
Journal ArticleDOI

Impact of Process Fluctuations on RF Small-Signal Parameter of Gate-All-Around Nanosheet Transistor Beyond 3 nm Node

TL;DR: In this article , the variations of RF small-signal model parameters induced by the intrinsic process fluctuations are investigated in gate-all-around (GAA) nanosheet transistor beyond 3 nm node.
References
More filters
Journal ArticleDOI

Phonon heat conduction in a semiconductor nanowire

TL;DR: In this article, a model for phonon heat conduction in a semiconductor nanowire with dimensions comparable to the phonon mean free path is developed based on the solution of Boltzmann's equation, which takes into account modification of the acoustic phonon dispersion due to spatial confinement, and change in the nonequilibrium phonon distribution due to partially diffuse boundary scattering.
Book

FinFET Modeling for IC Simulation and Design: Using the BSIM-CMG Standard

TL;DR: In this paper, the authors describe the rush in demand for advancing the technology from planar to 3D architecture, as now enabled by the approved industry standard, and give a strong foundation on the physics and operation of FinFET.
Journal ArticleDOI

RF Extraction of Self-Heating Effects in FinFETs

TL;DR: In this paper, the authors characterized the dynamic self-heating effect in n-channel SOI FinFETs, and the dependence of thermal resistance on finFET geometry is discussed.

FinFET modeling for IC simulation and design

TL;DR: FinFET Modeling for IC Simulation and Design Using the BSIM-CMG Standard Yogesh Singh Chauhan, Darsen Lu, Sriramkumar Venugopalan, Sourabh Khandelwal, Juan Pablo Duarte, Navid Paydavosi, Ai Niknejad, Chenming Hu.
Related Papers (5)