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Proceedings ArticleDOI

Negative-Capacitance FinFETs: Numerical Simulation, Compact Modeling and Circuit Evaluation

TLDR
In this article, a complete simulation framework for Negative Capacitance FinFETs including numerical simulation, compact model, and circuit evaluation is presented, where the influence of short-channel effects in Ferroelectric voltage amplification is incorporated.
Abstract
A complete simulation framework is presented for Negative Capacitance FinFETs including Numerical Simulation, Compact Modeling, and Circuit Evaluation. A 2D Numerical Simulation for FinFETs coupled with the Landau’s Ferroelectric Model captures device characteristics. A new version of the distributed Negative-Capacitance FinFET Compact Model is also presented in this work, where influence of short-channel effects in Ferroelectric voltage amplification are newly incorporated. Finally, a detailed analysis, from an energy perspective, is presented for the gate voltage amplification of Negative Capacitance FinFETs in ring-oscillator circuits.

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Citations
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Journal ArticleDOI

Spacer Engineering in Negative Capacitance FinFETs

TL;DR: In this article, the spacer design of the negative-capacitance FinFET (NC-FinFET) was investigated by using Sentaurus technology computer-aided design (TCAD).
Journal ArticleDOI

Analysis and Modeling of Inner Fringing Field Effect on Negative Capacitance FinFETs

TL;DR: In this paper, the impact of inner fringing fields on the negative capacitance FinFET (NC-FinFET) and how this scales with the technology node was investigated.
Journal ArticleDOI

Recent Advances in Negative Capacitance FinFETs for Low-Power Applications: A Review

TL;DR: In this article, the negative capacitance fin field effect transistors (NC-FinFETs) came up as the next-generation platform to withstand the aggressive scaling of transistors.
Journal ArticleDOI

Anomalously Beneficial Gate-Length Scaling Trend of Negative Capacitance Transistors

TL;DR: The negative capacitance field effect transistors exhibit excellent SS and DIBL improvements from the control MOSFET devices at very short gate lengths, a phenomenon which cannot be explained using conventional MOS FET theory.
Journal ArticleDOI

Sustained Benefits of NCFETs Under Extreme Scaling to the End of the IRDS

TL;DR: In this article, the authors use full quantum-transport simulations by coupling the Landau-Khalatnikov (LK) and Poisson equations self-consistently with the nonequilibrium Green's function (NEGF) formalism, and calibrated to experimental results, to investigate extremely scaled negative-capacitance, field effect transistors (NCFETs) having dimensions toward the end of the international roadmap for devices and systems (IRDS), that is, to sub-10-nm gate lengths, where channel transport can be expected to be governed by
References
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Journal ArticleDOI

Use of Negative Capacitance to Provide Voltage Amplification for Low Power Nanoscale Devices

TL;DR: By replacing the standard insulator with a ferroelectric insulator of the right thickness it should be possible to implement a step-up voltage transformer that will amplify the gate voltage thus leading to values of S lower than 60 mV/decade and enabling low voltage/low power operation.
Journal ArticleDOI

Ferroelectricity in Simple Binary ZrO2 and HfO2

TL;DR: A structural investigation revealed the orthorhombic phase to be of space group Pbc2(1), whose noncentrosymmetric nature is deemed responsible for the spontaneous polarization in this novel, nanoscale ferroelectrics.
Proceedings ArticleDOI

14nm Ferroelectric FinFET technology with steep subthreshold slope for ultra low power applications

TL;DR: In this paper, Doped hafnia ferroelectric layers with thicknesses from 3 to 8nm are integrated into state-of-the-art 14nm FinFET technology without any further process modification.
Proceedings ArticleDOI

Compact models of negative-capacitance FinFETs: Lumped and distributed charge models

TL;DR: In this article, the authors propose a lumped and distributed charge model for negative capacitance FinFETs, where the ferroelectric layer will impact the local channel charge and this distributed effect has important implications on device characteristics.
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