Open Access
Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods Maximum chip performance under peak permissible temperature limits may be achieved with the help of combined electrical and thermal simulation of VLSI circuits.
Massoud Pedram,Shahin Nazarian +1 more
TLDR
In this article, the authors present a brief discussion of key sources of power dissipation and their temperature relation in CMOS VLSI circuits, and techniques for full-chip temperature calculation with special attention to its implications on the design of high-performance, low-power very large scale integration (VLSI) circuits.Abstract:
The growing packing density and power con- sumption of very large scale integration (VLSI) circuits have made thermal effects one of the most important concerns of VLSI designers. The increasing variability of key process parameters in nanometer CMOS technologies has resulted in larger impact of the substrate and metal line temperatures on the reliability and performance of the devices and interconnec- tions. Recent data shows that more than 50% of all integrated circuit failures are related to thermal issues. This paper presents a brief discussion of key sources of power dissipation and their temperature relation in CMOS VLSI circuits, and techniques for full-chip temperature calculation with special attention to its implications on the design of high-performance, low-power VLSI circuits. The paper is concluded with an over- view of techniques to improve the full-chip thermal integrity by means of off-chip versus on-chip and static versus adaptive methods.read more
Citations
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Journal ArticleDOI
I and i
TL;DR: There is, I think, something ethereal about i —the square root of minus one, which seems an odd beast at that time—an intruder hovering on the edge of reality.
Nanoscale thermal transport. II. 2003–2012
David G. Cahill,Paul V. Braun,Gang Chen,David R. Clarke,Shanhui Fan,Kenneth E. Goodson,Pawel Keblinski,William P. King,Gerald D. Mahan,Arun Majumdar,Humphrey J. Maris,Simon R. Phillpot,Eric Pop,Li Shi +13 more
TL;DR: In this article, a review of thermal transport at the nanoscale is presented, emphasizing developments in experiment, theory, and computation in the past ten years and summarizes the present status of the field.
Proceedings ArticleDOI
Thermal-induced leakage power optimization by redundant resource allocation
Min Ni,Seda Ogrenci Memik +1 more
TL;DR: It is shown that there is a power density, hence, temperature, at which the total leakage power will reach its optimal value, and such an optimal resource number can be a better starting point for the subsequent switching-driven low power binding.
Dissertation
Modèles compacts électro-thermiques du premier ordre et considération de bruit pour les circuits 3D
TL;DR: In this article, a methode de conception globale for le circuit integre 3D dans le domaine electrique, thermique, electrothermique et aussi le bruit is presented.
Dissertation
Graphene Heat Spreaders for Electronics Thermal Management Applications
TL;DR: In this paper, thermal chemical vapor deposition (TCVD), liquid phase exfoliation (LPE) from graphite, and reduction of graphene ox- ide (GO) were used to synthesize graphene, and transfer methods were also demonstrated.
References
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Managing the Impact of Increasing Microprocessor Power Consumption
TL;DR: The design team focused from the beginning on reducing power consumption without negatively impacting either the performance or reliability of the processor in any significant way, resulting in a significant reduction in both maximum and typical processor power dissipation.
Journal ArticleDOI
Standby and Active Leakage Current Control and Minimization in CMOS VLSI Circuits
Farzan Fallah,Massoud Pedram +1 more
TL;DR: Circuit optimization and design automation techniques are introduced to bring leakage under control in CMOS circuits and present techniques for active leakage control.
Proceedings ArticleDOI
Full chip leakage-estimation considering power supply and temperature variations
TL;DR: A full chip leakage estimation technique which accurately accounts for power supply and temperature variations is presented and the results are demonstrated on large-scale industrial designs.
Journal ArticleDOI
3-D Thermal-ADI: a linear-time chip level transient thermal simulator
TL;DR: An efficient 3-D transient thermal simulator based on the alternating direction implicit (ADI) method for temperature estimation in a3-D environment, which not only has a linear runtime and memory requirement, but also is unconditionally stable.
Journal ArticleDOI
Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects
TL;DR: This study suggests that thermally aware analysis should become an integrated part of the various optimization steps in physical-synthesis flow to improve the performance and integrity of signals in global ultra large scale integration interconnects.
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