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Tunneling transistor suitable for low voltage operation

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TLDR
In this paper, the authors describe a tunneling transistor with a gate stack including a metallic gate electrode and a gate dielectric, and a junction that is substantially parallel to an interface between the metallic gate electrodes and the gate dieslectric.
Abstract
Several embodiments of a tunneling transistor are disclosed. In one embodiment, a tunneling transistor includes a semiconductor substrate, a source region formed in the semiconductor substrate, a drain region formed in the semiconductor substrate, a gate stack including a metallic gate electrode and a gate dielectric, and a tunneling junction that is substantially parallel to an interface between the metallic gate electrode and the gate dielectric. As a result of the tunneling junction that is substantially parallel with the interface between the metallic gate electrode and the gate dielectric, an on-current of the tunneling transistor is substantially improved as compared to that of a conventional tunneling transistor. In another embodiment, a tunneling transistor includes a heterostructure that reduces a turn-on voltage of the tunneling transistor.

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Citations
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References
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Journal ArticleDOI

Tunneling Field-Effect Transistors (TFETs) With Subthreshold Swing (SS) Less Than 60 mV/dec

TL;DR: In this paper, a 70-nm n-channel tunneling field effect transistor (TFET) with sub-threshold swing (SS) of 52.8 mV/dec at room temperature was demonstrated.
Journal ArticleDOI

Zener tunneling in semiconductors

TL;DR: In this paper, the Zener current in a constant field is calculated both with and without the W annier -A dams reduction of the interband-coupling terms, interpreted as a polarization correction.
Journal ArticleDOI

Band-to-band tunneling in carbon nanotube field-effect transistors.

TL;DR: How the structure of the nanotube is the key enabler of this particular one-dimensional tunneling effect is discussed, which is controlled here by the valence and conduction band edges in a bandpass-filter-like arrangement.
Journal ArticleDOI

A 90-nm logic technology featuring strained-silicon

TL;DR: In this paper, a leading-edge 90-nm technology with 1.2-nm physical gate oxide, 45-nm gate length, strained silicon, NiSi, seven layers of Cu interconnects, and low/spl kappa/CDO for high-performance dense logic is presented.
Journal ArticleDOI

Beyond the conventional transistor

TL;DR: In this paper, the authors focus on approaches to continue CMOS scaling by introducing new device structures and new materials, including high-dielectric-constant (high-k) gate dielectric, metal gate electrode, double-gate FET and strained-silicon FET.