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These are the first reported metal gate transistors in the III‐V materials and the first using a nonepitaxial base and laterally seeded overgrowth.
The transistors exhibit high current gains over 200, which is comparable to those in transistors grown on InP substrates.
Our results provide clues to better understand oxide transistors and to optimize their performance.
Our findings paint a picture of BTI and TDDB that in many respects is similar to that of Si transistors but with some unique characteristics.
I–V characteristics of the transistors before and after preparation indicate that the sectioned transistors show a higher leakage current, but are still functionally operational.
The data are consistent with the formation of parasitic transistors resulting from the microdose deposited in the gate oxides of these devices by the heavy ions.
Journal ArticleDOI
Qin Zhang, Wei Zhao, Alan Seabaugh 
555 Citations
This formula is consistent with two recent reports of interband tunnel transistors, which show lower than 60-mV/dec subthreshold swings and provides two simple design principles for configuring these transistors.
Our conclusions are also supported by the observation of similar activation energies for defects present in transistors of various device geometries.
Our conclusions are further supported by measuring all currents in the three-terminal configuration of the transistors before and during the breakdown and by using a drain current injection technique.
In this paper, we report the first demonstration of high voltage NPN bipolar junction transistors in 4H-SiC.

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