G
Gaurav Sharma
Researcher at Shenzhen University
Publications - 1520
Citations - 40824
Gaurav Sharma is an academic researcher from Shenzhen University. The author has contributed to research in topics: Medicine & Chemistry. The author has an hindex of 82, co-authored 1244 publications receiving 31482 citations. Previous affiliations of Gaurav Sharma include Northeastern University & D. E. Shaw & Co..
Papers
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Book ChapterDOI
An Identity-based Ring Signcryption Scheme
TL;DR: This paper presents a new ID-based ring signcryption scheme, motivated to the scheme provided by Zhu et al. (2013), and is proven to be secure against adaptive chosen ciphertext ring attacks (IND-IDRSC-CCA2) and secure against an existential forgery for adaptive chosen message attacks (EF-IDrSC-ACMA).
Journal ArticleDOI
Color Control Functions for Multiprimary Displays—I: Robustness Analysis and Optimization Formulations
TL;DR: A framework for analyzing robustness of CCFs for multiprimary displays against primary and observer variations is developed, incorporating a common model of human color perception and analytical and numerical approaches for determining robust CCFs are proposed.
Journal ArticleDOI
Knowledge, attitude and practices of institution-based dentists toward nicotine replacement therapy
TL;DR: Lack of detailed knowledge regarding NRT reduces the chance of practicing inspite of having a positive attitude among institutionally attached dentists, according to a study conducted in Odisha, India.
Taste masking of Promethazine Hydrochloride using Eudragit E100via solid dispersion technique to develop fast disintegrating tablets
TL;DR: In this article, the authors used solid dispersion technique using Eudragit E100 (amino-alkyl methacrylate======copolymer) in different ratios to mask the intensely bitter taste of promethazine HCl and to formulate fast disintegrating tablets of the taste masked drug.
Proceedings ArticleDOI
Thermal modeling and characterization of the embedded micro wafer level package (EMWLP) at the package- and system-level
Yen Yi Germaine Hoe,Tang Gongyue,Gaurav Sharma,Damaragunath Pinjala,Vempati Srinivasa Rao,Jong Ming Chinq,Sharon Lim Pei Siang,Aditya Kumar,Ho Soon Wee,Zhang Xiaowu,V. Kripesh +10 more
TL;DR: In this article, a package-level thermal modeling of the embedded micro-wafer-level-packaging (EMWLP) package has been performed to extract the parametric trends for thermal design guidelines of an eccentric single active die embedded alongside an integrated passive device (IPD), as shown in Fig. 1.