Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.

Cooling techniques for electronic equipment

A review on design and optimization of forced air-cooled cold plate for avionic application

Thermal management and temperature control of a containerised rapid deployment radar system

In a field where change and growth is inevitable, new electronic packaging problems continuously arise. Smaller, but more powerful devices are prone to overheating causing intermittent system failures, corrupted signals and outright system failure. Current study is focused on the analysis of the optimized working of electronic equipment from thermal point of view. In order to achieve the objective, an approach was developed for the thermal analysis of Printed Circuit Board (PCB) including the heat dissipation of its electronic components and then removal of the heat in a sophisticated manner by considering the conduction and convection modes of heat transfer. Mathematical modeling was carried out for a certain problem to address the thermal design, and then a program was developed in MATLAB for the solution of model by using Newton-Raphson method. The proposed unit is to be mounted on an aircraft having suspected thermal characteristics owing to abrupt changes in pressure and temperature as aircraft moves quickly from a lower altitude to higher altitude. In current study, dominant mode of heat transfer was conduction revealing that the major portion of heat transfer takes place by copper cladding and that heat conduction along the length of PCB can be improved enormously by using even thin layer of copper. The results confirmed that temperatures of all the electronic components were within derated values. Meanwhile, it was known that convection also plays a significant role in the reduction of temperatures of the components. The reduction in nodal temperature was in the range of 13 to 42 %. Furthermore, altitude variation from sea level to 15240 m (above sea level) caused the reduction in pressure from 1atm to 0.1095 atm. Consequently, the temperature of the electronic components increased from 73.25oC to 83.83oC for first node ‘a’, and from 66.04oC to 68.47oC for last node 'n' because of the decrease in the convective heat transfer coefficient.

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An Optimized Thermal Analysis of Electronic Unit Used in Aircraft

This paper proposed a Design Framework for HPC Reliability (DFHR) which consists of reliability prediction, Failure Hotspots (FHs) exploring, reliability program planning, and reliability plan implementation. In DFHR, 1) a concept of failure hotspot is proposed which provides targets for reliability engineering; 2) a unified process of reliability design is included in the framework with a constant respect to reliability technique costs; 3) the engineering practicability of the framework is achieved by hierarchy reliability planning and reasonable approximation; 4) highly precise reliability prediction methods are included in the framework. Based on the practice results of DFHR in the reliability design of a high performance computer, we demonstrate that DFHR is suitable for the cost-effective reliability design of HPC systems.

DFHR: A Design Framework for HPC Reliability

This paper describes a new automated process currently being developed and implemented at General Dynamics Convair/Space Systems Divisions to enhance the reliability of printed circuit boards (PCB's). The process is entitled Convair-Computer Aided Reliable Design (C-CARD) and is used to optimize the component mounting locations on a PCB for thermal reliability. PCB information contained in a computer-aided design (CAD) database is used to automatically produce a thermal mathematical model for use with the SINDA finitedifference heat-transfer code. Resulting temperature and reliability predictions are displayed and evaluated by the packaging engineer based on the design requirements. A plot of isotherms on the PCB surface is also determined from the analysis. If necessary, the components are relocated and this procedure is repeated. The isotherm data are used to guide any needed relocation. Once the PCB design is optimized for thermal reliability, it is then released for manufacture. In this way, the heat-transfer analysis is integrated into the design process and provides the packaging engineer with a thermally safe design in minutes instead of weeks.

Cooling techniques for electronic equipment

Citations

A review on design and optimization of forced air-cooled cold plate for avionic application

Thermal management and temperature control of a containerised rapid deployment radar system

An Optimized Thermal Analysis of Electronic Unit Used in Aircraft

DFHR: A Design Framework for HPC Reliability

Automated thermal and reliability analysis of avionics designs

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