Open AccessBook
Cooling techniques for electronic equipment
TLDR
In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.Abstract:
Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.read more
Citations
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CFD aided reflow oven profiling for PCB preheating in a soldering process : Part 2(2)
TL;DR: In this article, a CFD-aided profile prediction algorithm was developed and applied to modelling of preheating of a PCB with non-uniform distribution of component thermal mass in a forced air convection solder reflow oven.
Patent
Electrostatic chuck having bonded structure and method of manufacturing the same
Tomoyuki Fujii,Tsuneaki Ohashi +1 more
TL;DR: In this article, an electrostatic chuck having a bonded structure comprising a ceramic electrostatic chamber member, a metal member and a bonding layer is described, with the bonding layer having at least a first most outer bonding layer being joined to the metal member, and polyimide layer as an intermediate layer disposed between the first and second most outer layers.
Journal ArticleDOI
Multiobjective Optimal Placement of Convectively and Conductively Cooled Electronic Components on Printed Wiring Boards
Nestor V. Queipo,Guy F. Gil +1 more
TL;DR: In this paper, the authors present a solution methodology for the optimal placement of convective conductively air-cooled electronic components on planar printed wiring boards with thermal and electrical/cost design objectives.
Book ChapterDOI
Conduction Heat Transfer in Electronic Equipment
TL;DR: In this paper, the authors proposed a convective heat transfer model based on Fourier's law and molecular motion, which is the result of conduction through the thermal boundary layer.
Journal ArticleDOI
Performance of a guided plate heat sink at high altitude
Mohamed L. Elsayed,Mohamed L. Elsayed,Osama Mesalhy,Osama Mesalhy,John P. Kizito,Quinn Leland,Louis C. Chow +6 more
TL;DR: In this article, the thermal performance of an enhanced air-cooled heat sink system, comprising of a parallel plate-fin heat sink (PPFHS) with a guide plate installed to alter the bypass flow, was analyzed for fan-driven convection conditions at various altitudes from sea level to 12,000m.