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Cooling techniques for electronic equipment

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TLDR
In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Abstract
Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.

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Journal ArticleDOI

Numerical analysis of 3D regimes of natural convection and surface radiation in a differentially heated enclosure

TL;DR: In this paper, a numerical analysis of 3D regimes of convection-radiation heat transfer in a cubic enclosure with two isothermal faces and adiabatic walls is performed.
Patent

Fan for cooling a computer

Yi-Lung Kuo
TL;DR: A fan assembly includes a fan mounted within a housing that features an inward concave arrangement for an inner face of its housing to reduce the distance between the housing and a center shaft of the fan blades as mentioned in this paper.
Journal ArticleDOI

Effect of horizontal spacing and tilt angle on thermo-buoyant natural convection from two horizontally aligned square cylinders

TL;DR: In this article, a finite volume method (FVM) was used to quantify the momentum and heat transfer characteristics of two horizontally aligned square cylinders, and the results showed that the average Nu has a strong dependence on both Gr and Pr.
Proceedings ArticleDOI

A PCB system integration concept for power electronics

TL;DR: In this paper, a new PCB system integration concept for power converters construction, Power Sandwich, that allows for a high density packaging, effective thermal management and automated manufacturing is introduced, and a Power Sandwich demonstrator is designed and implemented using modified standard components representing the prototype of x-dimension components.
Journal ArticleDOI

Effect of inclination angle on the forced convective flow of a power-law fluid in a 2-D planar branching channel

TL;DR: In this article, the authors examined the role of power-law fluid behavior and branch inclination on momentum and heat transfer characteristics of the laminar forced convection of powerlaw fluids in a rectangular branching channel, which have been numerically investigated over a wide range of parameters such as Reynolds number, 50.