Open AccessBook
Cooling techniques for electronic equipment
TLDR
In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.Abstract:
Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.read more
Citations
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Proceedings ArticleDOI
Multilayer SMT high power density packaging of electronic ballasts for HID lamps
TL;DR: In this article, a double-sided SMT x-dim components that have uniform height and enhanced thermal properties are stacked between planar substrates to achieve size reduction and better thermal performance of HID lamp ballast.
Journal ArticleDOI
CBGA solder joint thermal fatigue life estimation by a simple method
TL;DR: In this paper, a simple analysis method was developed to determine the fatigue life of a ceramic ball grid array (CBGA) solder joint when exposed to thermal environments, and an iteration technique was used to obtain a convergent solution for the solder joint strains during temperature cycling.
Patent
Kühlkörper für eine Drossel oder einen Transformator und Drossel und Transformator mit einem solchen Kühlkörper
TL;DR: In this article, a vorliegende erfindung betrifft einen Kuhlkorper (400, 500, 600) fur eine Drossel (105) oder einen Transformator, während der Kuhl korper bereitzustellen, mit dem eine gewunschte Abkopplung der Kuh lung von der direkten Umgebung der Drossels (105 bzw. des Transformators and a gute Verlustleistungs-bz
Journal ArticleDOI
Convective Heat Transfer with Buoyancy Effects from Thermal Sources on a Flat Plate
Shikha Tewari,Yogesh Jaluria +1 more
TL;DR: In this paper, an experimental study on the thermal interaction between two finite-size heat sources, located on a flat plate that is well insulated on the back, was carried out on the horizontal and the vertical orientations of the surface.
Journal ArticleDOI
A simulation-based study on the effect of package parameters on the random vibration behavior of electronic packages
TL;DR: In this article, the effect of package design parameters on the mechanical behavior of electronic assemblies under random vibrations has been investigated and the main focus of this work is to investigate the impact of the array type, i.e., full vs. perimeter, on solder stresses.