scispace - formally typeset
Open AccessBook

Cooling techniques for electronic equipment

Reads0
Chats0
TLDR
In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Abstract
Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.

read more

Citations
More filters
Journal ArticleDOI

CAE Supported Ornamental Flame Product Design—Vortex Flow Guiding with Fuel Lift Mechanism

TL;DR: In this paper, a vortex flame design process was investigated and combined qualitative and CAE (computer-aided engineering) simulation was proposed to fulfill the functional requirement of an ornamental flame with acceptable height.
Proceedings ArticleDOI

Electronics warming and optimization study subject to low temperature environments

H. Khalkhali, +1 more
TL;DR: In this paper, an analytical model is developed to study the thermal management of such a system, which is used to perform an optimization study and to recommend a heater controller design for a given specification.
Journal ArticleDOI

Controlling the flow and heat transfer characteristics of power-law fluids in T-junctions using a rotating cylinder

TL;DR: In this paper, the combined influence of the power-law rheology and isothermal rotating cylinder has been investigated numerically on the flow and heat transfer characteristics in a T-channel, where the cylinder placed at the T-junction imitates the functioning of a rotating valve which controls the flow rate and the enthalpy distribution of the exiting streams in two branches.
Proceedings ArticleDOI

Finite layer spectral method for thermal analyses of layered printed circuit boards

TL;DR: In this paper, a finite layer spectral method (FLSM) is proposed for three-dimensional thermal analyses of layered printed circuit boards (PCBs) with surface mounted components, which can be extended to solve problems with internal heat sources.
Proceedings ArticleDOI

Experimental and Numerical Study of Transient Electronic Chip Cooling by Liquid Flow in Microchannel Heat Sink

TL;DR: In this paper, an experimental setup and numerical model were developed to test the effects of different parameters and their influence on the transient electronic chip cooling by liquid flow in microchannel heat sinks.