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Cooling techniques for electronic equipment
TLDR
In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.Abstract:
Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.read more
Citations
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Journal ArticleDOI
Experimental investigation of mixed convection in multiple ventilated enclosure with discrete heat sources
Satish Kumar Ajmera,A.N. Mathur +1 more
TL;DR: In this paper, mixed convection heat transfer in multiple ventilated enclosure with three numbers of discrete heat sources at bottom is investigated experimentally, each of the three heat sources has been flush mounted at the enclosure bottom and subjected to uniform heat flux.
Journal ArticleDOI
Experimental and Numerical Study of Transient Electronic Chip Cooling by Liquid Flow in Microchannel Heat Sinks
TL;DR: In this article, an experimental system and a numerical model were developed to test the effects of different parameters and their influence on the transient electronic chip cooling by liquid flow in microchannel heat sinks.
ReportDOI
A fundamentally new approach to air-cooled heat exchangers.
TL;DR: In this article, the authors describe breakthrough results obtained in a feasibility study of a fundamentally new architecture for air-cooled heat exchangers, which provides a several-fold reduction in boundary layer thickness, intrinsic immunity to heat sink fouling, and drastic reductions in noise.
Journal ArticleDOI
Measurement and modeling of time- and spatial-resolved wafer surface temperature in inductively coupled plasmas
TL;DR: In this article, the transient temperature profile across a commercial wafer temperature sensor device in an inductively coupled Ar plasma is reported, and the measured temperatures are compared to model predictions, based on a coupled plasma-wafer model.
Proceedings ArticleDOI
Conduction cooling of large LED array systems
TL;DR: In this article, a sheet metal and graphite system was proposed to provide an adequate thermal path for the LED thermal dissipation with flexible graphite, which can effectively cool the same thermal load.