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Journal ArticleDOI

Investigation of Gate Sidewall Spacer Optimization From OFF-State Leakage Current Perspective in 3-nm Node Device

TLDR
In this article, the structural and material optimization of gate sidewall spacer in the perspective of off-state leakage current was performed in a 3-nm node nanoplate FET.
Abstract
In this paper, the structural and material optimization of gate sidewall spacer in the perspective of OFF-state leakage current was performed in a 3-nm node nanoplate FET (NPFET). Gate-induced drain leakage (GIDL) current, a dominant factor of OFF-state leakage current, and active performance (ON-current, ON/OFF current ratio, and dynamic performance) were co-optimized according to the structural correlation of gate sidewall spacer with other structural components such as gate, source, and drain length. By optimizing the structure for gate and spacer, intrinsic delay was improved by 9.8%, GIDL current was reduced by ~78%, and then on/off current ratio ( ${I}_{\mathrm{\scriptscriptstyle ON}}/{I}_{\mathrm{\scriptscriptstyle OFF}})$ was enhanced by 4.2 times. On-current ( ${I}_{\mathrm{\scriptscriptstyle ON}}$ ) according to contact resistance ( ${R}_{\text {con}}$ ) and dynamic performance was analyzed in relation to source/drain (S/D) and spacer. Consequently, the intrinsic delay was improved by 10% and GIDL current reduced by about 92%, which enhanced ${I}_{\mathrm{\scriptscriptstyle ON}}/{I}_{\mathrm{\scriptscriptstyle OFF}}$ by 7.9 times accordingly. Furthermore, by comparing structural relations between gate spacer and S/D spacer, a better structural optimization method was proposed.

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Citations
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Journal ArticleDOI

Investigation of Electrical Characteristic Behavior Induced by Channel-Release Process in Stacked Nanosheet Gate-All-Around MOSFETs

TL;DR: In this article, several issues attributed to the channel-release process in vertically stacked-gate-all-around MOSFETs (GAAFETs) having various nanosheet (NS) widths were rigorously investigated.
Journal ArticleDOI

Design and Optimization of Triple-k Spacer Structure in Two-Stack Nanosheet FET From OFF-State Leakage Perspective

TL;DR: In this article, a triple-k spacer structure with three spacer regions consisting of two inner spacers (inner spacer 1 and inner spacer 2) formed by two atomic layer deposition (ALD) processes leveraging the inner Spacer formation-process method and outer spacer process of stack gate-all-around (GAA) process is proposed.
Journal ArticleDOI

Analysis of Self Heating Effect in DC/AC Mode in Multi-Channel GAA-Field Effect Transistor

TL;DR: In this article, the self-heating effect (SHE) of both dc and ac for a three-channel nanowire-field effect transistor (FET) is investigated and analyzed.
Journal ArticleDOI

Investigation of Sidewall High- k Interfacial Layer Effect in Gate-All-Around Structure

TL;DR: The optimized electrical characteristics were obtained and improved electrical performances were obtained in a 5-nm node nanosheet field-effect transistor (NSFET) with highly saturated ON-/OFF-current ratio.
References
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Journal ArticleDOI

High Performance Silicon Nanowire Field Effect Transistors

TL;DR: In this article, the influence of source-drain contact thermal annealing and surface passivation on key transistor properties was examined, and it was shown that thermal annaling and passivation of oxide defects using chemical modification can increase the average transconductance from 45 to 800 nS and average mobility from 30 to 560 cm 2 /V
Journal ArticleDOI

FinFET-a self-aligned double-gate MOSFET scalable to 20 nm

TL;DR: In this paper, a self-aligned double-gate MOSFET, FinFET was proposed by using boron-doped Si/sub 04/Ge/sub 06/ as a gate material.
Journal ArticleDOI

Moore's law: past, present and future

TL;DR: Moore's Law has become the central driving force of one of the most dynamic of the world's industries as discussed by the authors, and it is viewed as a reliable method of calculating future trends as well, setting the pace of innovation, and defining the rules and the very nature of competition.
Journal ArticleDOI

Small-Diameter Silicon Nanowire Surfaces

TL;DR: These hydrogen-terminated SiNW surfaces seem to be more oxidation-resistant than regular silicon wafer surfaces, because atomically resolved STM images of SiNWs were obtained in air after several days' exposure to the ambient environment.
Journal ArticleDOI

Short-channel effect in fully depleted SOI MOSFETs

TL;DR: In this article, the short channel effect in fully depleted silicon-on-insulator MOSFETs has been studied by a two-dimensional analytical model and by computer simulation, and it is found that the vertical field through the depleted film strongly influences the lateral field across the source and drain regions.
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