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Journal ArticleDOI

Slow transients observed in AlGaN/GaN HFETs: effects of SiN/sub x/ passivation and UV illumination

TLDR
In this article, the surface potential changes are caused by electrons which tunnel from the gate under high bias stress and get trapped at the surface states near the gate, which correlates with a large improvement in microwave power performance in these devices after passivation.
Abstract
Very slow drain current and surface potential transients have been observed in AlGaN/GaN heterostructure field effect transistors that are subjected to high bias stress. Simultaneous measurements of drain current and surface potential indicate that large change in surface potential after stress is responsible for the reduction in drain current in these devices. Measurements of surface potential profile from the gate edge toward the drain as a function of time indicate that surface potential changes occur mostly near the gate. It is proposed that the surface potential changes are caused by electrons which tunnel from the gate under high bias stress and get trapped at the surface states near the gate. Passivation of the surface with SiN/sub x/ reduces the transient magnitudes to a large extent. This correlates with a large improvement in microwave power performance in these devices after passivation. UV illumination of these devices totally eliminates the drain current and surface potential transients.

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Citations
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Journal ArticleDOI

Reliability of GaN High-Electron-Mobility Transistors: State of the Art and Perspectives

TL;DR: In this article, failure modes and mechanisms of AlGaN/GaN high-electron-mobility transistors are reviewed, and data from three de-accelerated tests are presented, which demonstrate a close correlation between failure mode and bias point.
Journal ArticleDOI

A Current-Transient Methodology for Trap Analysis for GaN High Electron Mobility Transistors

TL;DR: In this paper, the authors present a methodology to study trapping characteristics in GaN HEMTs that is based on current-transient measurements and identify several traps inside the AlGaN barrier layer or at the surface close to the gate edge and in the GaN buffer.
Journal ArticleDOI

Surface-related drain current dispersion effects in AlGaN-GaN HEMTs

TL;DR: In this paper, the authors investigated drain current dispersion effects in AlGaN-GaN HEMTs by means of pulsed, transient, and small-signal measurements.
Journal ArticleDOI

Effective Passivation of AlGaN/GaN HEMTs by ALD-Grown AlN Thin Film

TL;DR: In this paper, an effective passivation technique for AlGaN/GaN high-electron-mobility transistors (HEMTs) was presented, which features an AlN thin film grown by plasma-enhanced atomic layer deposition (PEALD).
Journal ArticleDOI

Deep traps in GaN-based structures as affecting the performance of GaN devices

TL;DR: In this paper, the role of deep defects in trapping in AlGaN/GaN, InAlN/AlGaN structures and transistors and in degradation of transistor parameters during electrical stress tests and after irradiation is discussed.
References
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Journal ArticleDOI

Two-dimensional electron gases induced by spontaneous and piezoelectric polarization charges in N- and Ga-face AlGaN/GaN heterostructures

TL;DR: In this article, the authors investigated the role of spontaneous and piezoelectric polarization on the carrier confinement at GaN/AlGaN and AlGaN/GaN interfaces.
Journal ArticleDOI

The impact of surface states on the DC and RF characteristics of AlGaN/GaN HFETs

TL;DR: In this article, the authors show that the cause of current collapse is a charging up of a second virtual gate, physically located in the gate drain access region, thus acting as a negatively charged virtual gate.
Journal ArticleDOI

The effect of surface passivation on the microwave characteristics of undoped AlGaN/GaN HEMTs

TL;DR: In this paper, the authors reported the highest reported microwave power density for undoped sapphire substrated AlGaN/GaN HEMT's on the same wafer.
Journal ArticleDOI

Trapping effects and microwave power performance in AlGaN/GaN HEMTs

TL;DR: In this article, the dc small-signal and microwave power output characteristics of AlGaN/GaN HEMTs are presented, and it is demonstrated that gate lag is related to surface trapping and drain current collapse is associated with the properties of the GaN buffer layer.
Journal ArticleDOI

Very-high power density AlGaN/GaN HEMTs

TL;DR: A flip-chip amplifier IC using a 4-mm device generated 14 W at 8 GHz, representing the highest CW power obtained from GaN-based integrated circuits to date.
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